參數(shù)資料
型號: AC03
廠商: NXP Semiconductors N.V.
英文描述: Cemented wirewound resistors
中文描述: 硬質(zhì)合金線繞電阻
文件頁數(shù): 24/24頁
文件大小: 144K
代理商: AC03
2000 Oct 20
24
BCcomponents
Product specification
Cemented wirewound resistors
AC01/03/04/05/07/10/15/20
4.23
4.23.2
4.23.3
climatic sequence:
dry heat
damp heat
(accelerated)
1
st
cycle
cold
low air pressure
damp heat
(accelerated)
remaining cycles
damp heat
(steady state)
temperature
coefficient
Ba
Db
16 hours; 200
°
C
24 hours; 55
°
C; 95 to 100% RH
4.23.4
4.23.5
4.23.6
Aa
M
Db
2 hours;
40
°
C
1 hour; 8.5 kPa; 15 to 35
°
C
5 days; 55
°
C; 95 to 100% RH
R/R max.:
±
1% + 0.05
4.24.2
3 (Ca)
56 days; 40
°
C; 90 to 95% RH;
dissipation
0.01 P
n
at 20/
40/20
°
C, 20/200/20
°
C:
R < 10
R
10
no visible damage
R/R max.:
±
1% + 0.05
4.8.4.2
TC
≤ ±
600
×
10
6
/K
80
×
10
6
TC
TC
+140
×
10
6
/K
hot-spot temperature less
than maximum body
temperature
R/R max.:
±
2% + 0.1
temperature rise
horizontally mounted, loaded with P
n
4.13
short time overload
room temperature; dissipation 10
×
P
n
;
5 s (voltage not more than
1000 V/25 mm)
1000 hours loaded with P
n
;
1.5 hours on and 0.5 hours off
1000 hours loaded with 0.9P
n
;
1.5 hours on and 0.5 hours off
1000 hours; 200
°
C; no load
4.25.1
endurance (at 40
°
C)
no visible damage
R/R max.:
±
5% + 0.1
no visible damage
R/R max.:
±
5% + 0.1
no visible damage
R/R max.:
±
5% + 0.1
4.25.1
endurance (at 70
°
C)
4.23.2
27 (Ba)
endurance at upper
category temperature
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
4.29
45 (Xa)
component solvent
resistance
resistance to soldering
heat
solderability
(after ageing)
70% 1.1.2 trichlorotrifluoroethane and
30% isopropyl alcohol; H
2
0
10 s; 260
±
5
°
C; flux 600
no visible damage
4.18
20 (Tb)
R/R max.:
±
0.5% + 0.05
4.17
20 (Tb)
16 hours steam or 16 hours at 155
°
C;
2
±
0.5 s in solder at 235
±
5
°
C;
flux 600
applied voltage (
±
10%):
R < 10
: 0.1 V
10
R < 100
: 0.3 V
100
R < 1 k
: 1 V
1 k
R < 10 k
: 3 V
10 k
R
33 k
: 10 V
good tinning (
95%
covered); no damage
4.5
tolerance on
resistance
R
R
nom
:
±
5% max.
IEC
60115-1
CLAUSE
IEC
60068
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
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