參數(shù)資料
型號(hào): AAT3690IWP-4.2-T1
廠商: Advanced Analog Technology,lnc.
英文描述: 1.0A USB Port/Adapter Lithium-Ion/Polymer Battery Charger
中文描述: 安培USB接口/適配器鋰離子電池充電器
文件頁數(shù): 17/20頁
文件大?。?/td> 425K
代理商: AAT3690IWP-4.2-T1
AAT3690
1.0A USB Port/Adapter
Lithium-Ion/Polymer Battery Charger
3690.2007.01.1.2
17
Capacitor Selection
Input Capacitor
In general, it is good design practice to place a
decoupling capacitor between the ADP and USB
pins and ground. An input capacitor in the range of
1
μ
F to 22
μ
F is recommended. If the source supply
is unregulated, it may be necessary to increase the
capacitance to keep the input voltage above the
under-voltage lockout threshold during device
enable and when battery charging is initiated.
If the AAT3690 adapter input is to be used in a sys-
tem with an external power supply source, such as
a typical AC-to-DC wall adapter, then a C
IN
capaci-
tor in the range of 10
μ
F should be used. A larger
input capacitor in this application will minimize
switching or power bounce effects when the power
supply is "hot plugged." Likewise, a 10
μ
F or greater
input capacitor is recommended for the USB input
to help buffer the effects of USB source power
switching, noise, and input cable impedance.
Output Capacitor
The AAT3690 only requires a 1
μ
F ceramic capaci-
tor on the BAT pin to maintain circuit stability. This
value should be increased to 10
μ
F or more if the
battery connection is made any distance from the
charger output. If the AAT3690 is to be used in
applications where the battery can be removed
from the charger, such as in the case of desktop
charging cradles, an output capacitor greater than
10
μ
F may be required to prevent the device from
cycling on and off when no battery is present.
Printed Circuit Board Layout
Considerations
For the best results, it is recommended to physical-
ly place the battery pack as close to the AAT3690
BAT pin as possible. To minimize voltage drops on
the PCB, keep the high current carrying traces ade-
quately wide. For maximum power dissipation of
the AAT3690 TDFN package, the metal substrate
should be solder bonded to the board. It is also rec-
ommended to maximize the substrate contact to the
PCB ground plane layer to further increase local
heat dissipation.
Figure 3: AAT3690 Evaluation Board Schematic.
D2
D1
R1
8.06K
R5
1.5K
R4
1.5K
R3
10K
R2
8.06K
C1
10
μ
F
C2
10
μ
F
C3
10
μ
F
C4
0.1
μ
F
BAT
ADP
USB
CT
TS
1 2 3
ON/OFF
J1
GND
4
USB
1
BAT
2
ADP
3
USBSET
11
EN
5
USB
10
TS
6
CT
9
STAT2
7
STAT1
8
ADPSET
12
AAT3690
U1
0
J2
DS1 (a)
BAV74LT1
DS1 (b)
BAV74LT1
GRN
LED
RED
LED
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