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參數(shù)資料
| 型號： | AAT2315_07 |
| 廠商： | Advanced Analog Technology,lnc. |
| 英文描述： | Dual 600mA Step-Down Converter with Synchronization |
| 中文描述： | 雙600mA降壓轉(zhuǎn)換器的同步 |
| 文件頁數(shù)： | 22/22頁 |
| 文件大小： | 693K |
| 代理商： | AAT2315_07 |
Package Information
1
QFN33-16
All dimensions in millimeters.
3
±
Pin 1 Dot By Marking
1
±
0
±
3.000
±
0.05
0.500
±
0.05
0
±
Pin 1 Identification
C0.3
0
±
0.214
±
0.036
0.230
±
0.05
Top View
Bottom View
Side View
1
13
5
9
AAT2513
Dual 600mA Step-Down
Converter with Synchronization
22
2513.2007.04.1.1
Advanced Analogic Technologies, Inc.
830 E. Arques Avenue, Sunnyvale, CA 94085
Phone (408) 737-4600
Fax (408) 737-4611
Advanced Analogic Technologies, Inc.
AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work
rights, or other intellectual property rights are implied. AnalogicTech reserves the right to make changes to their products or specifications or to discontinue any product or service with-
out notice. Except as provided in AnalogicTech’s terms and conditions of sale, AnalogicTech assumes no liability whatsoever, and AnalogicTech disclaims any express or implied war-
ranty relating to the sale and/or use of AnalogicTech products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,
copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the
customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent AnalogicTech deems necessary to support this warranty.
Specific testing of all parameters of each device is not necessarily performed. AnalogicTech and the AnalogicTech logo are trademarks of Advanced Analogic Technologies Incorporated.
All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.
1. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the
lead terminals due to the manufacturing process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required
to ensure a proper bottom solder connection.
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