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A82DL16x4T(U) Series
PRELIMINARY
(August, 2005, Version 0.0)
46
AMIC Technology, Corp.
SRAM
DC Electrical Characteristics
(T
A
= -40
°
C to +85
°
C, VCC_S = 2.7V to 3.6V, GND = 0V)
Symbol
Parameter
- 70 ns
Unit
Conditions
Min.
Max.
I
LI
Input Leakage Current
-
1
μ
A
V
IN
= GND to
VCC_S
I
LO
Output Leakage Current
-
1
μ
A
CE1_S
= V
IH
or
CE2_S = V
IL
or
OE = V
IH
or WE = V
IL
V
I/O
= GND to VCC
I
CC_S
Active Power Supply
Current
-
3
mA
CE1_S
= V
IL
,
CE2_S = V
IH
I
I/O
= 0mA
I
CC1_S
Dynamic Operating
-
30
mA
Min. Cycle, Duty = 100%
CE1_S
= V
IL
,
CE2_S
= V
IH
I
I/O
= 0mA
I
CC2_S
Current
-
3
mA
CE1_S
= V
IL
,
CE2_S
= V
IH
V
IH
= VCC_S, V
IL
= 0V
f = 1 MH
Z,
I
I/O
= 0mA
I
SB_S
-
0.5
mA
VCC_S
≤
3.3V
,
CE1_S
= V
IH
or
CE2_S
=V
IL
I
SB1_S
Standby Power Supply
Current
-
5
μ
A
VCC
≤
3.3V,
CE1_S
≥
VCC - 0.2V
or
CE2_S
≤
0.2V, V
IN
≥
0V
V
OL
Output Low Voltage
-
0.4
V
I
OL
= 2.1mA
V
OH
Output High Voltage
2.2
-
V
I
OH
= -1.0mA
Truth Table
Mode
CE1_S
CE2_S
OE
WE
I/O Operation
Supply Current
Standby
H
X
X
X
High Z
I
SB
, I
SB1
X
L
X
X
High Z
I
SB
, I
SB1
Output Disable
L
H
H
H
High Z
I
CC,
I
CC1,
I
CC2
Read
L
H
L
H
D
OUT
I
CC,
I
CC1,
I
CC2
Write
L
H
X
L
D
IN
I
CC,
I
CC1,
I
CC2
Note: X = H or L
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| A82DL1624TG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70I | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A82DL1624TG-70 | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70F | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70I | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70IF | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70U | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
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