參數(shù)資料
型號(hào)： A54SX72A-PQ208M
廠商： Electronic Theatre Controls, Inc.
英文描述： Hex Buffers / Drivers with Open-Collector High-Vltage Outputs 14-SOIC 0 to 70
中文描述： 的SX - A系列FPGA的
文件頁(yè)數(shù)： 31/108頁(yè)
文件大?。?/td> 720K
代理商： A54SX72A-PQ208M
SX-A Family FPGAs
v5.1
2-11
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient, case, or
board temperatures. This is an important distinction because dynamic and static power consumption will cause the
chip's junction to be higher than the ambient, case, or board temperatures.
EQ 2-9
and
EQ 2-10
give the relationship
between thermal resistance, temperature gradient and power.
EQ 2-9
EQ 2-10
Where:
θ
JA
T
----------------
T
A
–
P
=
θ
JA
T
-----------------
T
A
–
P
=
θ
JA
=
Junction-to-air thermal resistance
θ
JC
=
Junction-to-case thermal resistance
T
J
= Junction temperature
T
A
= Ambient temperature
T
C
= Ambient temperature
P
= total power dissipated by the device
Table 2-12
Package Thermal Characteristics
Package Type
Pin
Count
θ
JC
θ
JA
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14
33.5
27.4
25
°
C/W
Thin Quad Flat Pack (TQFP)
144
11
33.5
28
25.7
°
C/W
Thin Quad Flat Pack (TQFP)
176
11
24.7
19.9
18
°
C/W
Plastic Quad Flat Pack (PQFP)
1
208
8
26.1
22.5
20.8
°
C/W
Plastic Quad Flat Pack (PQFP) with Heat Spreader
2
208
3.8
16.2
13.3
11.9
°
C/W
Plastic Ball Grid Array (PBGA)
329
3
17.1
13.8
12.8
°
C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°
C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°
C/W
Fine Pitch Ball Grid Array (FBGA)
484
3.2
18
14.7
13.6
°
C/W
Notes:
1. The A54SX08A PQ208 has no heat spreader.
2. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.
相關(guān)PDF資料
PDF描述
A54SX72A-TQ208 SX-A Family FPGAs
A54SX72A-TQ208A Hex Buffers / Drivers with Open-Collector High-Vltage Outputs 14-PDIP 0 to 70
A54SX72A-TQ208B Hex Buffers / Drivers with Open-Collector High-Vltage Outputs 14-PDIP 0 to 70
A54SX16A-3BG208B SX-A Family FPGAs
A54SX16A-3BG208I SX-A Family FPGAs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX72A-PQG208 功能描述:IC FPGA 360I/O 208PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門(mén)數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241
A54SX72A-PQG208A 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX72A-PQG208I 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX72A-PQG208M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 72K Gates 4024 Cells 217MHz 0.25um Technology 2.5V 208-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 208 - Trays
A54SX72A-PQG208X3 制造商:Microsemi Corporation 功能描述:SX-A 72K GATE 4024 MC 217MHZ COMM ANTIFUSE 2.5/3.3/5V 208QFP - Trays
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