Notes: 1. For more information about the CQFP package options, refer to t" />
參數(shù)資料
型號： A54SX32A-1BG329
廠商： Microsemi SoC
文件頁數(shù)： 21/108頁
文件大?。?/td> 0K
描述： IC FPGA SX 48K GATES 329-BGA
標(biāo)準(zhǔn)包裝： 27
系列： SX-A
LAB/CLB數(shù)： 2880
輸入/輸出數(shù)： 249
門數(shù)： 48000
電源電壓： 2.25 V ~ 5.25 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 329-BBGA
供應(yīng)商設(shè)備封裝： 329-PBGA（31x31）
SX-A Family FPGAs
ii
v5.3
Ordering Information
Device Resources
Notes:
1. For more information about the CQFP package options, refer to the HiRel SX-A datasheet.
2. All –3 speed grades have been discontinued.
Package Lead Count
A54SX16A
PQ
208
2
Part Number
A54SX08A = 12,000 System Gates
A54SX16A = 24,000 System Gates
A54SX32A = 48,000 System Gates
A54SX72A = 108,000 System Gates
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
2
–F = Approximately 40% Slower than Standard
Package Type
BG = 1.27 mm Plastic Ball Grid Array
FG = 1.0 mm Fine Pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
CQ = Ceramic Quad Flat Pack
1
Application (Temperature Range)
Blank = Commercial (0 to +70°)
I
= Industrial (-40 to +85°C)
A
= Automotive (-40 to +125°C)
M = Military (-55 to +125°C)
B
= MIL-STD-883 Class B
G
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
User I/Os (Including Clock Buffers)
Device
208-Pin
PQFP
100-Pin
TQFP
144-Pin
TQFP
176-Pin
TQFP
329-Pin
PBGA
144-Pin
FBGA
256-Pin
FBGA
484-Pin
FBGA
A54SX08A
130
81
113
–
111
–
A54SX16A
175
81
113
–
111
180
–
A54SX32A
174
81
113
147
249
111
203
249
A54SX72A
171
–
203
360
Notes: Package Definitions: PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = Plastic Ball Grid Array,
FBGA = Fine Pitch Ball Grid Array
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PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-1BG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX32A-1BG329M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 278MHZ 0.25UM/0.22UM 2.5V 329 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 249 I/O 329PBGA
A54SX32A-1BGG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
A54SX32A-1BGG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX32A-1BGG329M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 278MHZ 0.25UM/0.22UM 2.5V 329 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 329PBGA
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