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參數(shù)資料
| 型號： | UPG138GV-E1 |
| 廠商： | NEC Corp. |
| 元件分類： | 晶體 |
| 英文描述： | CRYSTAL 24.0 MHZ 20PF SMD |
| 中文描述： | L波段單刀雙擲開關(guān) |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 64K |
| 代理商： | UPG138GV-E1 |
7
P
PG138GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
[
P
PG138GV]
Soldering process
Soldering conditions
Recommended condition symbol
Infrared ray reflow
Package peak temperature: 235
q
C
Hour: within 30 s. (more than 210
q
C)
Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215
q
C
Hour: within 40 s. (more than 200
q
C)
Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260
q
C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300
q
C, Hour: within 10 s.
Limited days: no.
Note
Note
It is storage days after opening a dry pack, the storage conditions are 25
q
C, less than 65 %, RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
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