Table 1-19 A54SX16P Timing Characteristics (Worst-Case Commercial " />
參數(shù)資料
型號: A54SX16P-TQ176
廠商: Microsemi SoC
文件頁數(shù): 26/64頁
文件大小: 0K
描述: IC FPGA SX 24K GATES 176-TQFP
標準包裝: 40
系列: SX
LAB/CLB數(shù): 1452
輸入/輸出數(shù): 147
門數(shù): 24000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 176-LQFP
供應商設備封裝: 176-TQFP(24x24)
SX Family FPGAs
1- 28
v3.2
A54SX16P Timing Characteristics
Table 1-19 A54SX16P Timing Characteristics
(Worst-Case Commercial Conditions, VCCR = 4.75 V, VCCA,VCCI = 3.0 V, TJ = 70°C)
Parameter
Description
'–3' Speed
'–2' Speed
'–1' Speed
'Std' Speed
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Units
C-Cell Propagation Delays1
tPD
Internal Array Module
0.6
0.7
0.8
0.9
ns
Predicted Routing Delays2
tDC
FO = 1 Routing Delay, Direct Connect
0.1
ns
tFC
FO = 1 Routing Delay, Fast Connect
0.3
0.4
0.5
ns
tRD1
FO = 1 Routing Delay
0.3
0.4
0.5
ns
tRD2
FO = 2 Routing Delay
0.6
0.7
0.8
0.9
ns
tRD3
FO = 3 Routing Delay
0.8
0.9
1.0
1.2
ns
tRD4
FO = 4 Routing Delay
1.0
1.2
1.4
1.6
ns
tRD8
FO = 8 Routing Delay
1.9
2.2
2.5
2.9
ns
tRD12
FO = 12 Routing Delay
2.8
3.2
3.7
4.3
ns
R-Cell Timing
tRCO
Sequential Clock-to-Q
0.9
1.1
1.3
1.4
ns
tCLR
Asynchronous Clear-to-Q
0.5
0.6
0.7
0.8
ns
tPRESET
Asynchronous Preset-to-Q
0.7
0.8
0.9
1.0
ns
tSUD
Flip-Flop Data Input Set-Up
0.5
0.7
0.8
ns
tHD
Flip-Flop Data Input Hold
0.0
ns
tWASYN
Asynchronous Pulse Width
1.4
1.6
1.8
2.1
ns
Input Module Propagation Delays
tINYH
Input Data Pad-to-Y HIGH
1.5
1.7
1.9
2.2
ns
tINYL
Input Data Pad-to-Y LOW
1.5
1.7
1.9
2.2
ns
Predicted Input Routing Delays2
tIRD1
FO = 1 Routing Delay
0.3
0.4
0.5
ns
tIRD2
FO = 2 Routing Delay
0.6
0.7
0.8
0.9
ns
tIRD3
FO = 3 Routing Delay
0.8
0.9
1.0
1.2
ns
tIRD4
FO = 4 Routing Delay
1.0
1.2
1.4
1.6
ns
tIRD8
FO = 8 Routing Delay
1.9
2.2
2.5
2.9
ns
tIRD12
FO = 12 Routing Delay
2.8
3.2
3.7
4.3
ns
Note:
1. For dual-module macros, use tPD + tRD1 + tPDn, tRCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route
timing is based on actual routing delay measurements performed on the device prior to shipment.
3. Delays based on 10 pF loading.
相關PDF資料
PDF描述
AX125-1FG256I IC FPGA AXCELERATOR 125K 256FBGA
AFS250-FG256I IC FPGA 2MB FLASH 250K 256FBGA
AFS250-FGG256I IC FPGA 2MB FLASH 250K 256FBGA
M1AFS250-FG256I IC FPGA 2MB FLASH 250K 256-FBGA
5748676-1 CONN BACKSHELL DB9 DIE CAST
相關代理商/技術參數(shù)
參數(shù)描述
A54SX16P-TQ176I 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX16P-TQG144 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX16P-TQG144I 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A54SX16P-TQG144M 功能描述:IC FPGA SX 24K GATES 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
A54SX16P-TQG176 功能描述:IC FPGA SX 24K GATES 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)