參數(shù)資料
型號(hào)： A54SX16A-FG208
廠商： Electronic Theatre Controls, Inc.
英文描述： LM134/LM234/LM334 3-Terminal Adjustable Current Sources; Package: TO-92; No of Pins: 3; Qty per Container: 1800; Container: Box
中文描述： 的SX - A系列FPGA的
文件頁(yè)數(shù)： 32/108頁(yè)
文件大?。?/td> 720K
代理商： A54SX16A-FG208
SX-A Family FPGAs
2-12
v5.1
Theta-JA
Junction-to-ambient thermal resistance (
θ
JA
) is determined under standard conditions specified by JESD-51 series but
has little relevance in actual performance of the product in real application. It should be employed with caution but is
useful for comparing the thermal performance of one package to another.
A sample calculation to estimate the absolute maximum power dissipation allowed (worst case) for a 329-pin PBGA
package at still air is as follows. i.e.:
EQ 2-11
The device's power consumption must be lower than the calculated maximum power dissipation by the package.
The power consumption of a device can be calculated using the Actel power calculator. If the power consumption is
higher than the device's maximum allowable power dissipation, then a heat sink can be attached on top of the case or
the airflow inside the system must be increased.
Theta-JC
Junction-to-case thermal resistance (
θ
JC
) measures the ability of a device to dissipate heat from the surface of the chip
to the top or bottom surface of the package. It is applicable for packages used with external heat sinks and only
applies to situations where all or nearly all of the heat is dissipated through the surface in consideration. If the power
consumption is higher than the calculated maximum power dissipation of the package, then a heat sink is required.
Calculation for Heat Sink
For example, in a design implemented in a FG484 package, the power consumption value using the power calculator is
3.00 W. The user-dependent data
T
J
and
T
A
are given as follows:
From the datasheet:
EQ 2-12
The 2.22 W power is less than then required 3.00 W; therefore, the design requires a heat sink or the airflow where the
device is mounted should be increased. The design's junction-to-air thermal resistance requirement can be estimated
by:
EQ 2-13
θ
JA
T
A
= 17.1°C/W is taken from
Table 2-12 on page 2-11
= 125°C is the maximum limit of ambient (from the datasheet)
Max. Allowed Power
--------------------------------------------------–
θ
JA
17.1
°
C/W
C
-----------------–
1.46 W
=
=
=
T
J
T
A
=
110°C
=
70°C
θ
JA
=
18.0°C/W
θ
JC
=
3.2 °C/W
P
--------------------------------------------------–
θ
JA
18.0
°
C/W
C
-----------------–
2.22 W
=
=
=
θ
JA
--------------------------------------------------–
P
-----------------–
C
3.00 W
13.33
°
C/W
=
=
=
相關(guān)PDF資料
PDF描述
A54SX16A-FG208A LM134/LM234/LM334 3-Terminal Adjustable Current Sources; Package: TO-92; No of Pins: 3; Qty per Container: 1800; Container: Box
A54SX16A-FG208B LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
A54SX16A-FG208I LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
A54SX16A-FG208M LM136-2.5/LM236-2.5/LM336-2.5V Reference Diode; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
A54SX16A-PQ208 LM136-5.0/LM236-5.0/LM336-5.0 5.0V Reference Diode; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX16A-FG256 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FG256A 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FG256I 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FG256M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 16K Gates 924 Cells 227MHz 0.25um/0.22um (CMOS) Technology 2.5V 256-Pin FBGA 制造商:Microsemi SOC Products Group 功能描述:FPGA SX-A 16K GATES 924 CELLS 227MHZ 0.25UM/0.22UM 2.5V 256F - Trays
A54SX16A-FGG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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