參數(shù)資料
型號(hào)： A54SX16A-FCQ208M
廠商： Electronic Theatre Controls, Inc.
英文描述： LM134/LM234/LM334 3-Terminal Adjustable Current Sources; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
中文描述： 的SX - A系列FPGA的
文件頁數(shù)： 28/108頁
文件大小： 720K
代理商： A54SX16A-FCQ208M
SX-A Family FPGAs
2-8
v5.1
Power Dissipation
A critical element of system reliability is the ability of electronic devices to safely dissipate the heat generated during
operation. The thermal characteristics of a circuit depend on the device and package used, the operating temperature,
the operating current, and the system's ability to dissipate heat.
A complete power evaluation should be performed early in the design process to help identify potential heat-related
problems in the system and to prevent the system from exceeding the device’s maximum allowed junction
temperature.
The actual power dissipated by most applications is significantly lower than the power the package can dissipate.
However, a thermal analysis should be performed for all projects. To perform a power evaluation, follow these steps:
1. Estimate the power consumption of the application.
2. Calculate the maximum power allowed for the device and package.
3. Compare the estimated power and maximum power values.
Estimating Power Dissipation
The total power dissipation for the SX-A family is the sum of the DC power dissipation and the AC power dissipation:
P
Total
= P
DC
+ P
AC
EQ 2-5
DC Power Dissipation
The power due to standby current is typically a small component of the overall power. An estimation of DC power
dissipation under typical conditions is given by:
P
DC
= I
Standby
* V
CCA
EQ 2-6
Note: For other combinations of temperature and voltage settings, refer to the
Calculator
相關(guān)PDF資料
PDF描述
A54SX16A-FG208 LM134/LM234/LM334 3-Terminal Adjustable Current Sources; Package: TO-92; No of Pins: 3; Qty per Container: 1800; Container: Box
A54SX16A-FG208A LM134/LM234/LM334 3-Terminal Adjustable Current Sources; Package: TO-92; No of Pins: 3; Qty per Container: 1800; Container: Box
A54SX16A-FG208B LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
A54SX16A-FG208I LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
A54SX16A-FG208M LM136-2.5/LM236-2.5/LM336-2.5V Reference Diode; Package: TO-46; No of Pins: 3; Qty per Container: 1000; Container: Box
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX16A-FFG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FFG256 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FFGG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FFGG256 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX16A-FG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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