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參數(shù)資料
| 型號(hào)： | A54SX08A-FGG144 |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 35/108頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SX 12K GATES 144-FBGA |
| 標(biāo)準(zhǔn)包裝： | 160 |
| 系列： | SX-A |
| LAB/CLB數(shù)： | 768 |
| 輸入/輸出數(shù)： | 111 |
| 門數(shù)： | 12000 |
| 電源電壓： | 2.25 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 144-LBGA |
| 供應(yīng)商設(shè)備封裝： | 144-FPBGA（13x13） |
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SX-A Family FPGAs
2- 12
v5.3
Theta-JA
Junction-to-ambient thermal resistance (θJA) is determined under standard conditions specified by JESD-51 series but
has little relevance in actual performance of the product in real application. It should be employed with caution but is
useful for comparing the thermal performance of one package to another.
A sample calculation to estimate the absolute maximum power dissipation allowed (worst case) for a 329-pin PBGA
package at still air is as follows. i.e.:
EQ 2-11
The device's power consumption must be lower than the calculated maximum power dissipation by the package.
The power consumption of a device can be calculated using the Actel power calculator. If the power consumption is
higher than the device's maximum allowable power dissipation, then a heat sink can be attached on top of the case or
the airflow inside the system must be increased.
Theta-JC
Junction-to-case thermal resistance (θJC) measures the ability of a device to dissipate heat from the surface of the chip
to the top or bottom surface of the package. It is applicable for packages used with external heat sinks and only
applies to situations where all or nearly all of the heat is dissipated through the surface in consideration. If the power
consumption is higher than the calculated maximum power dissipation of the package, then a heat sink is required.
Calculation for Heat Sink
For example, in a design implemented in a FG484 package, the power consumption value using the power calculator is
3.00 W. The user-dependent data TJ and TA are given as follows:
From the datasheet:
EQ 2-12
The 2.22 W power is less than then required 3.00 W; therefore, the design requires a heat sink or the airflow where the
device is mounted should be increased. The design's junction-to-air thermal resistance requirement can be estimated
by:
EQ 2-13
θ
JA
= 17.1°C/W is taken from Table 2-12 on page 2-11
TA
= 125°C is the maximum limit of ambient (from the datasheet)
Max. Allowed Power
Max Junction Temp
Max. Ambient Temp
–
θ
JA
------------------------------------------------------------------------------------------------------------
150
°C 125°C
–
17.1
°C/W
----------------------------------------
1.46 W
==
=
TJ = 110°C
TA = 70°C
θ
JA = 18.0°C/W
θ
JC = 3.2 °C/W
P
Max Junction Temp
Max. Ambient Temp
–
θ
JA
------------------------------------------------------------------------------------------------------------
110
°C70°C
–
18.0
°C/W
------------------------------------
2.22 W
==
=
θ
JA
Max Junction Temp
Max. Ambient Temp
–
P
------------------------------------------------------------------------------------------------------------
110
°C70°C
–
3.00 W
------------------------------------
13.33
°C/W
==
=
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A54SX08A-FGG144A | 功能描述:IC FPGA SX 12K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX08A-FGG144I | 功能描述:IC FPGA SX 12K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX08AFGG208A | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:SX-A Family FPGAs |
| A54SX08A-FGG208A | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:SX-A Automotive Family FPGAs |
| A54SX08AFGG208I | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:SX-A Family FPGAs |
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