
A45L9332A Series 
PRELIMINARY 
(October, 2001, Version 0.1) 
5 
AMIC Technology, Inc.
Absolute Maximum Ratings* 
Voltage on any pin relative to VSS (Vin, Vout )  . . . . . . . . .   
 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +4.6V 
Voltage on VDD supply relative to VSS (VDD, VDDQ )   
 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +4.6V 
Storage Temperature (T
STG
) . . . . . . . . .   -55
°
C to +150
°
C 
Soldering Temperature X Time (T
SLODER
) . . . . . . . . . . . . . . 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  260
°
C X 10sec 
Power Dissipation (P
D
) . . . . . . . . . . . . . . . . . . . . . . . .  1W 
Short Circuit Current (Ios) . . . . . .  . . . . . . . . . . . . .   50mA 
*Comments
Permanent device damage may occur if “Absolute Maximum 
Ratings” are  exceeded. 
Functional operation should be restricted to recommended 
operating condition. 
Exposure to higher than recommended voltage for extended 
periods of time could affect device reliability. 
Capacitance (T
A
=25°C, f=1MHz) 
Parameter 
Symbol 
Condition 
Min 
Typ 
Max 
Unit 
Input Capacitance 
CI1 
CI2 
A0 to A9, BA 
2 
2 
4 
4 
pF 
pF 
CLK, CKE, 
CS
 , 
RAS
 ,
 CAS
 ,
 WE
 , 
DQMi, DSF 
DQ0 to DQ15 
Data Input/Output Capacitance 
CI/O 
2 
6 
pF 
DC Electrical Characteristics  
Recommend operating conditions (Voltage referenced to VSS = 0V) 
Parameter 
Symbol 
Min 
Typ 
Max 
Unit 
Note 
Supply Voltage 
Input High Voltage 
Input Low Voltage 
Output High Voltage 
Output Low Voltage 
VDD,VDDQ 
V
IH
V
IL
V
OH
V
OL
3.0 
2.0 
-0.3 
2.4 
- 
3.3 
3.0 
0 
- 
- 
3.6 
V 
V 
V 
V 
V 
VDD+0.3 
0.8 
- 
0.4 
Note 1 
I
OH
 = -2mA 
I
OL
 = 2mA 
Input Leakage Current 
I
IL
-5 
- 
5 
μ
A 
μ
A 
Note 2 
Output Leakage Current 
I
OL
-5 
- 
5 
Note 3 
Output Loading Condition 
See Figure 1 
Note: 
1. V
IL
 (min) = -1.5V AC (pulse width 
≤
 5ns). 
2. Any input 0V 
≤
 VIN 
≤
 VDD + 0.3V, all other pins are not under test = 0V 
3. Dout is disabled, 0V 
≤
 Vout 
≤
 VDD 
Decoupling Capacitance Guide Line 
Recommended decoupling capacitance added to power line at board. 
Parameter 
Symbol 
Value 
Unit 
Decoupling Capacitance between VDD and VSS 
C
DC1
0.1 + 0.01 
μ
F 
μ
F 
Decoupling Capacitance between VDDQ and VSSQ 
C
DC2
0.1 + 0.01 
Note:
  1. VDD and VDDQ pins are separated each other. 
All VDD pins are connected in chip. All VDDQ pins are connected in chip. 
2. VSS and VSSQ pins are separated each other 
All VSS pins are connected in chip. All VSSQ pins are connected in chip.