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參數(shù)資料
| 型號(hào)： | A42MX36-FPQ240M |
| 英文描述： | Field Programmable Gate Array (FPGA) |
| 中文描述： | 現(xiàn)場(chǎng)可編程門(mén)陣列（FPGA） |
| 文件頁(yè)數(shù)： | 18/116頁(yè) |
| 文件大?。?/td> | 3110K |
| 代理商： | A42MX36-FPQ240M |
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40MX and 42MX FPGA Families
18
v5.0
Package Thermal Characteristics
The device junction-to-case thermal characteristic is
θ
jc
,
and the junction-to-ambient air characteristic is
θ
ja
. The
thermal characteristics for
θ
ja
are shown with two different
air flow rates. Ambient temperature (T
A
) is used for
commercial and industrial; case temperature (T
C
) is used
for military.
Maximum junction temperature is 150
°
C.
A sample calculation of the absolute maximum power
dissipation allowed for a PQFP 160-pin package at
commercial temperature is as follows:
Power Dissipation
General Power Equation
P = [I
CC
standby + I
CC
active] * V
CCI
+ I
OL
* V
OL
* N
+ I
OH
* (V
CCI
–
V
OH
) * M
where:
I
CC
standby is the current flowing when no inputs or
outputs are changing.
I
CC
active is the current flowing due to CMOS switching.
I
OL
, I
OH
are TTL sink/source currents.
V
OL
, V
OH
are TTL level output voltages.
N equals the number of outputs driving TTL loads to V
OL
.
M equals the number of outputs driving TTL loads to V
OH
.
Accurate values for N and M are difficult to determine
because they depend on the family type, on design details,
and on the system I/O. The power can be divided into two
components: static and active.
Static Power Component
Actel FPGAs have small static power components that
result in power dissipation lower than PALs or CPLDs. By
integrating multiple PALs/CPLDs into one FPGA, an even
greater reduction in board-level power dissipation can
be achieved.
The power due to standby current is typically a small
component of the overall power. Standby power is
calculated for commercial, worst-case conditions:
I
CC
V
CCA
2 mA
5.25 V
The static power dissipation by TTL loads depends on the
number of outputs driving HIGH or LOW, and on the DC load
current. Again, this number is typically small. For instance,
a 32-bit bus sinking 4 mA at 0.33V will generate 42 mW with
all outputs driving LOW, and 140 mW with all outputs driving
HIGH. The actual dissipation will average somewhere in
between, as I/Os switch states with time.
Power
10.5 mW
Plastic Packages
Pin Count
θ
jc
θ
ja
Still Air
300 ft/min
Plastic Quad Flat Pack
100
12
34
°
C/W
31
°
C/W
Plastic Quad Flat Pack
160
10
32
°
C/W
24
°
C/W
Plastic Quad Flat Pack
208
8
30
°
C/W
23
°
C/W
Plastic Quad Flat Pack
240
3.5
19
°
C/W
16
°
C/W
Plastic Leaded Chip Carrier
44
16
43
°
C/W
31
°
C/W
Plastic Leaded Chip Carrier
68
13
36
°
C/W
25
°
C/W
Plastic Leaded Chip Carrier
84
12
32
°
C/W
22
°
C/W
Thin Plastic Quad Flat Pack
176
11
28
°
C/W
21
°
C/W
Very Thin Plastic Quad Flat Pack
80
12
39
°
C/W
33
°
C/W
Very Thin Plastic Quad Flat Pack
100
10
38
°
C/W
32
°
C/W
Plastic Ball Grid Array
272
3
20
°
C/W
14.5
°
C/W
Ceramic Packages
Pin Count
θ
jc
θ
ja
Still Air
Ceramic Quad Flat Pack
208
6.3
22
°
C/W
Ceramic Quad Flat Pack
256
6.2
20
°
C/W
ja
(°C/W)
Max. junction temp. (°C) – Max. commercial temp.
32°C/W
150°C – 70°C
2.5
W
=
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| A42MX36-PQ208 | Field Programmable Gate Array (FPGA) |
| A42MX36-PQ208I | Field Programmable Gate Array (FPGA) |
| A42MX36-PQ208M | Field Programmable Gate Array (FPGA) |
| A42MX36-PQ240 | Field Programmable Gate Array (FPGA) |
| A42MX36-PQ240I | Field Programmable Gate Array (FPGA) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A42MX36-FPQG208 | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-FPQG240 | 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-PQ208 | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| A42MX36-PQ208A | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:MX 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門(mén)數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類(lèi)型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75） |
| A42MX36-PQ208I | 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
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