參數(shù)資料
型號: A42MX24-FPLG84
廠商: Microsemi SoC
文件頁數(shù): 110/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 36K 84-PLCC
標準包裝: 16
系列: MX
輸入/輸出數(shù): 72
門數(shù): 36000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 84-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 84-PLCC(29.31x29.31)
40MX and 42MX FPGA Families
Re vi s i on 11
1-3
A42MX24 and A42MX36 devices contain D-modules, which are arranged around the periphery of the
device. D-modules contain wide-decode circuitry, providing a fast, wide-input AND function similar to that
found in CPLD architectures (Figure 1-4). The D-module allows A42MX24 and A42MX36 devices to
perform wide-decode functions at speeds comparable to CPLDs and PALs. The output of the D-module
has a programmable inverter for active HIGH or LOW assertion. The D-module output is hardwired to an
output pin, and can also be fed back into the array to be incorporated into other logic.
Dual-Port SRAM Modules
The A42MX36 device contains dual-port SRAM modules that have been optimized for synchronous or
asynchronous applications. The SRAM modules are arranged in 256-bit blocks that can be configured as
32x8 or 64x4. SRAM modules can be cascaded together to form memory spaces of user-definable width
and depth. A block diagram of the A42MX36 dual-port SRAM block is shown in Figure 1-5.
The A42MX36 SRAM modules are true dual-port structures containing independent read and write ports.
Each SRAM module contains six bits of read and write addressing (RDAD[5:0] and WRAD[5:0],
respectively) for 64x4-bit blocks. When configured in byte mode, the highest order address bits (RDAD5
and WRAD5) are not used. The read and write ports of the SRAM block contain independent clocks
(RCLK and WCLK) with programmable polarities offering active HIGH or LOW implementation. The
SRAM block contains eight data inputs (WD[7:0]), and eight outputs (RD[7:0]), which are connected to
segmented vertical routing tracks.
The A42MX36 dual-port SRAM blocks provide an optimal solution for high-speed buffered applications
requiring FIFO and LIFO queues. The ACTgen Macro Builder within Microsemi's Designer software
Figure 1-3
42MX S-Module Implementation
CLR
Up to 7-Input Function Plus D-Type Flip-Flop with Clear
Up to 4-Input Function Plus Latch with Clear
D0
D1
S
Y
D
Q
GATE
CLR
OUT
Up to 8-Input Function (Same as C-Module)
D00
D01
D10
D11
S1
S0
Y
OUT
Up to 7-Input Function Plus Latch
D00
D01
D10
D11
S1
S0
Y
OUT
GATE
D
Q
D00
D01
D10
D11
S1
S0
Y
D
Q
OUT
相關(guān)PDF資料
PDF描述
APA300-PQG208 IC FPGA PROASIC+ 300K 208-PQFP
ASC35DRYS-S734 CONN EDGECARD 70POS DIP .100 SLD
APA300-PQ208 IC FPGA PROASIC+ 300K 208-PQFP
RBB95DHAT CONN EDGECARD 190PS R/A .050 DIP
EP4CE40F23C7N IC CYCLONE IV E FPGA 40K 484FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX24-FPQ160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A42MX24-FPQ208 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A42MX24-FPQG160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A42MX24-FPQG208 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A42MX24-FTQ176 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)