Input Module Predicted Routing Delays2
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  • 參數(shù)資料
    型號: A42MX16-1PQ100I
    廠商: Microsemi SoC
    文件頁數(shù): 117/142頁
    文件大?。?/td> 0K
    描述: IC FPGA MX SGL CHIP 24K 100-PQFP
    標(biāo)準(zhǔn)包裝: 66
    系列: MX
    輸入/輸出數(shù): 83
    門數(shù): 24000
    電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
    安裝類型: 表面貼裝
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 100-BQFP
    供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
    40MX and 42MX FPGA Families
    1- 72
    R e v i sio n 1 1
    Input Module Predicted Routing Delays2
    tIRD1
    FO = 1 Routing Delay
    2.6
    2.9
    3.2
    3.8
    5.3
    ns
    tIRD2
    FO = 2 Routing Delay
    2.9
    3.2
    3.6
    4.3
    6.0
    ns
    tIRD3
    FO = 3 Routing Delay
    3.2
    3.6
    4.0
    4.8
    6.6
    ns
    tIRD4
    FO = 4 Routing Delay
    3.5
    3.9
    4.4
    5.2
    7.3
    ns
    tIRD8
    FO = 8 Routing Delay
    4.8
    5.3
    6.1
    7.1
    10.0
    ns
    Global Clock Network
    tCKH
    Input LOW to HIGH
    FO = 32
    FO = 486
    4.4
    4.8
    5.3
    5.5
    6.0
    6.5
    7.1
    9.1
    10.0
    ns
    tCKL
    Input HIGH to LOW
    FO = 32
    FO = 486
    5.1
    6.0
    5.7
    6.6
    6.4
    7.5
    7.6
    8.8
    10.6
    12.4
    ns
    tPWH
    Minimum Pulse
    Width HIGH
    FO = 32
    FO = 486
    3.0
    3.3
    3.7
    3.8
    4.2
    4.5
    4.9
    6.3
    6.9
    ns
    tPWL
    Minimum Pulse
    Width LOW
    FO = 32
    FO = 486
    3.0
    3.3
    3.4
    3.7
    3.8
    4.2
    4.5
    4.9
    6.3
    6.9
    ns
    tCKSW
    Maximum Skew
    FO = 32
    FO = 486
    0.8
    1.0
    1.1
    1.6
    ns
    tSUEXT
    Input
    Latch
    External
    Set-Up
    FO = 32
    FO = 486
    0.0
    ns
    TTL Output Module Timing5
    tDLH
    Data-to-Pad HIGH
    3.4
    3.8
    4.3
    5.0
    7.1
    ns
    tDHL
    Data-to-Pad LOW
    4.0
    4.4
    5.0
    5.9
    8.3
    ns
    tENZH
    Enable Pad Z to HIGH
    3.6
    4.0
    4.5
    5.3
    7.4
    ns
    tENZL
    Enable Pad Z to LOW
    3.9
    4.4
    5.0
    5.8
    8.2
    ns
    tENHZ
    Enable Pad HIGH to Z
    7.2
    8.0
    9.1
    10.7
    14.9
    ns
    tENLZ
    Enable Pad LOW to Z
    6.7
    7.5
    8.5
    9.9
    13.9
    ns
    tGLH
    G-to-Pad HIGH
    4.8
    5.3
    6.0
    7.2
    10.0
    ns
    tGHL
    G-to-Pad LOW
    4.8
    5.3
    6.0
    7.2
    10.0
    ns
    tLSU
    I/O Latch Output Set-Up
    0.7
    0.8
    1.0
    1.4
    ns
    Table 1-37 A42MX24 Timing Characteristics (Nominal 3.3 V Operation) (continued)
    (Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
    –3 Speed
    –2 Speed
    –1 Speed
    Std Speed –F Speed
    Units
    Parameter / Description
    Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
    Notes:
    1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
    2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
    estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
    3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
    can be obtained from the Timer utility.
    4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
    External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
    external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
    5. Delays based on 35 pF loading.
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