參數(shù)資料
    型號: A40MX02-VQG80A
    廠商: Microsemi SoC
    文件頁數(shù): 53/142頁
    文件大?。?/td> 0K
    描述: IC FPGA MX SGL CHIP 3K 80-VQFP
    標準包裝: 90
    系列: MX
    輸入/輸出數(shù): 57
    門數(shù): 3000
    電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
    安裝類型: 表面貼裝
    工作溫度: -40°C ~ 125°C
    封裝/外殼: 80-TQFP
    供應(yīng)商設(shè)備封裝: 80-VQFP(14x14)
    40MX and 42MX FPGA Families
    1- 14
    R e v i sio n 1 1
    parallel ports are connected to the internal core logic tile and the input, output and control ports of an I/O
    buffer to capture and load data into the register to control or observe the logic state of each I/O.
    Figure 1-13 42MX IEEE 1149.1 Boundary Scan Circuitry
    Table 1-3
    Test Access Port Descriptions
    Port
    Description
    TMS
    (Test Mode Select)
    Serial input for the test logic control bits. Data is captured on the rising edge of the test logic
    clock (TCK).
    TCK
    (Test Clock Input)
    Dedicated test logic clock used serially to shift test instruction, test data, and control inputs
    on the rising edge of the clock, and serially to shift the output data on the falling edge of the
    clock. The maximum clock frequency for TCK is 20 MHz.
    TDI
    (Test Data Input)
    Serial input for instruction and test data. Data is captured on the rising edge of the test logic
    clock.
    TDO
    (Test Data Output)
    Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive
    state (high impedance) when data scanning is not in progress.
    Table 1-4
    Supported BST Public Instructions
    Instruction
    IR Code
    (IR2.IR0)
    Instruction
    Type
    Description
    EXTEST
    000
    Mandatory
    Allows the external circuitry and board-level interconnections to be
    tested by forcing a test pattern at the output pins and capturing test
    results at the input pins.
    SAMPLE/PRELOAD
    001
    Mandatory
    Allows a snapshot of the signals at the device pins to be captured
    and examined during operation
    HIGH Z
    101
    Optional
    Tristates all I/Os to allow external signals to drive pins. Please refer to
    the IEEE Standard 1149.1 specification.
    CLAMP
    110
    Optional
    Allows state of signals driven from component pins to be determined
    from the Boundary-Scan Register. Please refer to the IEEE Standard
    1149.1 specification for details.
    BYPASS
    111
    Mandatory
    Enables the bypass register between the TDI and TDO pins. The test
    data passes through the selected device to adjacent devices in the
    test chain.
    Boundary Scan Register
    Instruction
    Decode
    Control Logic
    TAP Controller
    Instruction
    Register
    Bypass
    Register
    TMS
    TCK
    TDI
    Output
    MUX
    TDO
    JTAG
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