3-4 Revision 13 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These" />
參數(shù)資料
型號： A3PE600-FG256I
廠商： Microsemi SoC
文件頁數(shù)： 3/162頁
文件大?。?/td> 0K
描述： IC FPGA 600000 GATES 256-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： ProASIC3E
RAM 位總計(jì)： 110592
輸入/輸出數(shù)： 165
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FPBGA（17x17）
Pin Descriptions and Packaging
3-4
Revision 13
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
相關(guān)PDF資料
PDF描述
A42MX09-2VQG100I IC FPGA MX SGL CHIP 14K 100VQFP
A42MX09-2VQ100I IC FPGA MX SGL CHIP 14K 100VQFP
A54SX16-VQG100 IC FPGA SX 24K GATES 100-VQFP
A54SX16-VQ100 IC FPGA SX 24K GATES 100-VQFP
ACC43DRXI-S734 CONN EDGECARD 86POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PE600-FG484 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A3PE600-FG484I 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
A3PE600-FG484IX3 制造商:Microsemi Corporation 功能描述:PROASIC3E 600K GATES IND FLASH 1.5V 484 FBGA - Trays
A3PE600-FG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-FG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*