4-32 Revision 13 FG676 Note For Package Manufacturing and Environmental information, visit the Resource Center at h" />
參數(shù)資料
型號: A3PE600-2PQG208I
廠商: Microsemi SoC
文件頁數(shù): 38/162頁
文件大?。?/td> 0K
描述: IC FPGA 600000 GATES 208-PQFP
標(biāo)準(zhǔn)包裝: 24
系列: ProASIC3E
RAM 位總計: 110592
輸入/輸出數(shù): 147
門數(shù): 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
Package Pin Assignments
4-32
Revision 13
FG676
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Note: This is the bottom view of the package.
A1 Ball Pad Corner
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相關(guān)PDF資料
PDF描述
4-552008-1 CONN CHAMP COVER 50 POS 180 DEG
HSC43DRAN CONN EDGECARD 86POS R/A .100 SLD
EPF10K30AQI208-3N IC FLEX 10KA FPGA 30K 208-PQFP
HSC43DRAH CONN EDGECARD 86POS R/A .100 SLD
552079-1 CONN COVER STR RLF 14POS 180DEG
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