3-4 Revision 13 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These" />
參數(shù)資料
型號： A3PE600-1PQG208I
廠商： Microsemi SoC
文件頁數(shù)： 3/162頁
文件大?。?/td> 0K
描述： IC FPGA 600000 GATES 208-PQFP
標(biāo)準(zhǔn)包裝： 24
系列： ProASIC3E
RAM 位總計： 110592
輸入/輸出數(shù)： 147
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
Pin Descriptions and Packaging
3-4
Revision 13
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
相關(guān)PDF資料
PDF描述
A3PE600-1PQ208I IC FPGA 600000 GATES 208-PQFP
A42MX09-1TQG176 IC FPGA MX SGL CHIP 14K 176-TQFP
A54SX32A-TQ144A IC FPGA SX 48K GATES 144-TQFP
APA300-FGG256 IC FPGA PROASIC+ 300K 256-FBGA
APA300-FG256 IC FPGA PROASIC+ 300K 256-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PE600-1PQG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-1PQG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-1PQG896I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-1PQG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-2FG256 功能描述:IC FPGA 600000 GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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