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參數(shù)資料
| 型號： | A3P600L-1FGG484I |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 152/242頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 600K 484-FBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | ProASIC3L |
| RAM 位總計(jì)： | 110592 |
| 輸入/輸出數(shù)： | 235 |
| 門數(shù)： | 600000 |
| 電源電壓： | 1.14V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 484-BGA |
| 供應(yīng)商設(shè)備封裝： | 484-FPBGA（23x23） |
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ProASIC3L Low Power Flash FPGAs
Revision 13
5-3
Revision 10
continued
3.3 V LVCMOS and 1.2 V LVCMOS wide range were added to applicable tables in the
Values for 1.2 V LVCMOS were added to tables in the "Detailed I/O DC Characteristics"
section, with Minimum and Maximum DC Input and Output Levels tables, are new.
Complete timing data for wide range will be available in a later revision of the datasheet
(SARs 37161, 38188).
The notes regarding drive strength in the "Summary of I/O Timing Characteristics –
Default I/O Software Settings" section tables were revised for clarification. They now
state that the minimum drive strength for the default software configuration when run in
wide range is ±100 A. The drive strength displayed in software is supported in normal
range only. For a detailed I/V curve, refer to the IBIS models (SAR 34761).
Table 2-39 I/O Weak Pull-Up/Pull-Down Resistances was updated with additional
values and the definitions of RWEAK PULL-UP-MAX and RWEAK PULL-DOWN-MAX were
corrected (SAR 34756).
The paragraph above Table 2-44 Duration of Short Circuit Event before Failure was
revised to change the maximum temperature from 110°C to 100°C, with an example of
six months instead of three months. The row for 110°C was removed from the table for
consistency with Table 2-2 Recommended Operating Conditions 1 (SAR 34744).
The AC Loading figures in the "Single-Ended I/O Characteristics" section were updated
to match tables in the "Summary of I/O Timing Characteristics – Default I/O Software
Settings" section (SAR 34890).
The following sentence was deleted from the "2.5 V LVCMOS" section (SAR 34797): "It
uses a 5 V–tolerant input buffer and push-pull output buffer."
The table notes were revised for LVDS Table 2-174 Minimum and Maximum DC Input
and Output Levels (SAR 34813).
Values for the maximum frequency for input and output DDR were added to tables in the
"DDR Module Specifications" section (SAR 34805).
Minimum pulse width High and Low values were added to the tables in the "Global Tree
Timing Characteristics" section. The maximum frequency for global clock parameter
was removed from these tables because a frequency on the global is only an indication
of what the global network can do. There are other limiters such as the SRAM, I/Os, and
PLL. SmartTime software should be used to determine the design frequency (SAR
36965).
CCC/PLL Specification were updated. A note was added to indicate that when the
CCC/PLL core is generated by Microsemi core generator software, not all delay values
of the specified delay increments are available (SAR 34825).
Figure 2-46 Write Access after Write onto Same Address, Figure 2-47 Read Access
after Write onto Same Address, and Figure 2-48 Write Access after Read onto Same
Address were deleted. Reference was made to a new application note, Simultaneous
covers these cases in detail (SAR 34873).
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
tables, Figure 2-50 FIFO Reset, and the FIFO "Timing Characteristics" tables were
revised to ensure consistency with the software names (SAR 35751).
Figure 2-48 FIFO Read and Figure 2-49 FIFO Write are new (SAR 34849).
The "Pin Descriptions and Packaging" chapter is new (SAR 34773).
Revision
Changes
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