![](http://datasheet.mmic.net.cn/90000/A3064LKA-TL_datasheet_2980957/A3064LKA-TL_7.png)
3064
HALL-EFFECT
GEAR-TOOTH SENSOR
—AC COUPLED
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
6
the teeth create transitions in the magnetic field that have a
much higher frequency content than the basic rotational speed
of the target. This allows the device to sense speeds much
lower than those indicated by the graph for a given capacitor
value.
Capacitor Characteristics. The major requirement for
the external capacitor is its ability to operate in a bipolar (non-
polarized) mode. Another important requirement is the low
leakage current of the capacitor (equivalent parallel resistance
should be greater than 500 k
). To maintain proper operation
with frequency, capacitor values should be held to within
±30%
over the operating temperature range. The commonly available
Z5U ceramic capacitor temperature code should not be used in
this application.
Magnet Selection. The A3064LKA can be used with a
wide variety of commercially available permanent magnets.
The selection of the magnet depends on the operational and
environmental requirements of the sensing system. For systems
that require high accuracy and large working air gaps or an
extended temperature range, the usual magnet material of
choice is rare-earth samarium cobalt (SmCo). This magnet
material has a high energy product and can operate over an
extended temperature range. For systems that require low-cost
solutions for an extended temperature range, AlNiCo 8 can be
used. Due to its relatively low energy product, smaller opera-
tional air gaps can be expected. Neodymium iron boron
(NeFeB) can be used over moderate temperature ranges when
large working air gaps are required. Of these three magnet
materials, AlNiCo 8 is the least expensive by volume and SmCo
is the most expensive.
Extensive applications information for Hall-effect sensors
is available in:
Hall-Effect IC Applications Guide, Application Note 27701;
Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulat-
ing, and Lead Forming, Application Note 27703.1;
Soldering of Through-Hole Hall-Sensor Dervices, Application
Note 27703; and
Soldering of Surface-Mount Hall-Sensor Devices, Application
Note 27703.2.
All are provided in Allegro Electronic Data Book, AMS-702. or
at
www.allegromicro.com
APPLICATIONS INFORMATION (cont’d)
Figure 4
SENSOR LOCATIONS
(
±0.005 [0.13 mm] die placement)
A
Dwg. MH-007E
0.0165"
0.42 mm
NOM
BRANDED
SURFACE
ACTIVE AREA DEPTH
0.087"
2.20 mm
12
4
5
3
E1
E2
0.083"
2.10 mm
0.075"
1.91 mm
Allegro