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參數(shù)資料
| 型號(hào)： | 9970-4XXX-08 |
| 英文描述： | SMT QuickGrip |
| 中文描述： | 貼片QuickGrip |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 432K |
| 代理商： | 9970-4XXX-08 |
M/A-COM Division of AMP Incorporated
I
North America: Tel. (800) 366-2266, Fax (800) 618-8883
I
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
I
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
V3.00
SMT|QuickGrip plug receptacles are designed for reflow soldering processes.
Flow (wave) soldering is not appropriate for this device.
The type of solder paste selected for reflow soldering is generally a function of
many factors relative to the overall system PCB design. Most applications will use
common electronic grade solders such as: 63/37, 60/40 or 62/36/2 with mild
rosin/resin fluxes. Metal content of the paste for screen and/or stencil applications
is generally 85-90% by weight, slightly lower for nozzle dispensing applications.
When screening or stenciling, soldering paste thickness of .15mm (.006 inch) to
.25mm (.010) is recommended.
Soldering
Figure 3
Typical Infrared and Convection Heating/Soldering Profile
Figure 4
Typical Vapor Phase Heating/Soldering Profile
SMT|QuickGrip Plug receptacles can withstand most electronics grade
cleaning agents including: high temperature water/aqueous cleaners, ethanol,
methanol, MEK, acetone, 1,1,1-tricloroethane, trichlordethylene, perchloroehtylene,
chloroflorocarbon (CFC) solvents, isopropanol, dichlorofluoroethane, and blends.
The Omni-Flex cables can also withstand mild exposure to the above listed
cleaning agents.
Post-Solder Cleaning
TEMP
°
C
250
200
150
100
50
SOLDER
PASTE
CURE
30-60 SEC
50-100
°
C
AMBIENT OR
FORCED
COOL DOWN
REFLOW
20 - 40 SEC
AT 235
°
C TYP.
240 - 250
°
C MAX
PREHEAT
FLUX MELT/ACTIVATION
SOLDER SPHERE MELT BEGINS
60 - 90 SEC AT 100 - 200
°
C
TEMP
°
C
250
200
150
100
50
10 - 30 MIN
AT
80 - 130
°
C
PREHEAT
30 - 180 SEC
AT 110 - 150
°
C
AMBIENT
OR
FORCED
COOL DOWN
REFLOW
20 - 90 SEC
AT 215
°
C
Application Notes
Note: Unless otherwise specified, all dimensions are mm/in.
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