![](http://datasheet.mmic.net.cn/50000/97-68340-P_datasheet_1934832/97-68340-P_1.png)
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Convert surface mount QFP packages to a 15x15 PGA footprint
Reduce costs by using less expensive QFP packages to replace PGA footprints in
existing designs
Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact
Consult factory for panelized form or for mounting of consigned chips
GENERAL SPECIFICATIONS
ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces
PADS: bare Cu protected with ENIG or immersion white Sn to eliminate copla-
narity concerns and solder bridges associated with hot air solder leveling
PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
PIN PLATING: 200μ [5.08μ] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per
ASTM B 545 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.062 ±0.003 [1.58 ±0.08] dia.
Will plug into standard PGA sockets
18025
Rev. AA
P/N 97-68340 for Motorola 68340
144-Pin QFP-to-PGA Adapter
ORDERING INFORMATION
P/N 97-68340
P/N 97-68340-P for Panelized Form
P/N 145-PGM15024-30 for Wire Wrap PGA
Socket
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE: Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS