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參數資料
| 型號： | 95678-001 |
| 英文描述： | BUCHSE RJ45 PCB HOR GESCHIRMT 1REIHIG |
| 中文描述： | 比克澤個RJ45賀永GESCHIRMT 1REIHIG板 |
| 文件頁數： | 14/18頁 |
| 文件大?。?/td> | 81K |
| 代理商： | 95678-001 |
TYPE
PRODUCT SPECIFICATION
NUMBER
GS-12-083
TITLE
Single and Multi-Port Modular Jack Assemblies
PAGE
REVISION
14 of 18
F
AUTHORIZED BY
DATE
B. Brubaker
27 Mar 01
CLASSIFICATION
UNRESTRICTED
Copyright 2001 FCI USA, INC.
Form E-3334
02/12/01
GS-01-001
8.5
Resistance to Solvents. The housing shall exhibit no deterioration after exposure to various
solvents commonly used in past-soldering cleaning procedures. The test shall be in accordance
with EIA 364-11 at room temperature.
8.6
Durability. The following durability levels are specified:
Level 1 -
Level 2 -
Level 3 -
Level 4 -
250 cycles
750 cycles
1000 cycles
2500 cycles
After the durability testing, the spring form shall remain as specified in paragraph 7.2. The
contact resistance shall not exceed 40 milliohms for signal lines and/or 80 milliohms for shield
tabs. Test method per IEC 512-5, Test 9a.
For durability levels 2 thru 5, perform half of the cycles, then mixed flowing gas followed by the
remaining half of the durability cycles. LLCR (per Para. 6.1) readings to be taken as shown in the
table.
Test procedures for durability levels 1 thru 5:
Level 1
250 cycles
LLCR
Mixed flowing gas
Per IEC 603-7 Annex D
Mixed flowing gas
Per IEC 603-7 Annex D
Mixed flowing gas
Per IEC 603-7 Annex D
Mixed flowing gas
Per IEC 603-7 Annex D
N/A
N/A
Level 2
375 cycles
LLCR
LLCR
375 cycles
Level 3
500 cycles
LLCR
LLCR
500 cycles
Level 4
1250 cycles LLCR
LLCR
1250 cycles
8.7
Solderability - ANSI-J-002, Test Condition A
a) Steam aging: 1 hour
b) Contact areas evaluated shall meet the ANSI-J-002 requirements.
8.8
Resistance to Soldering Heat. The housing shall withstand the high temperatures encountered
during soldering of the jack to the printed wiring board without any functional deterioration. The
test shall be in accordance with MIL-STD-202, Method 210, Test Condition E. The following
details shall apply:
a) Solder Temperature: 260 degrees C
b) Immersion Duration: 5 seconds
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