型號: | 93C66BXT-I/SN |
元件分類: | PROM |
英文描述: | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
封裝: | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
文件頁數(shù): | 1/30頁 |
文件大小: | 550K |
代理商: | 93C66BXT-I/SN |
相關PDF資料 |
PDF描述 |
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93LC66BX-E/OT | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO6 |
93LC66CXT-I/SN | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
93LC66AT-I/MC | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
93LC66BXT-I/MC | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
93AA66AX-I/OT | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO6 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
---|---|
93C66BXTISNG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM |
93C66BXTIST | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM |
93C66BXTISTG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM |
93C66C | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM |
93C66C/S15K | 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |