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參數(shù)資料
| 型號(hào)： | 93C46BX-E/PG |
| 元件分類： | PROM |
| 英文描述： | 64 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
| 封裝： | 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 |
| 文件頁(yè)數(shù)： | 11/28頁(yè) |
| 文件大小： | 420K |
| 代理商： | 93C46BX-E/PG |
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2005 Microchip Technology Inc.
DS21749F-page 19
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.30
0.25
0.19
.012
.010
.007
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
0.70
0.60
0.50
.028
.024
.020
L
Foot Length
3.10
3.00
2.90
.122
.118
.114
D
Molded Package Length
4.50
4.40
4.30
.177
.173
.169
E1
Molded Package Width
6.50
6.38
6.25
.256
.251
.246
E
Overall Width
0.15
0.10
0.05
.006
.004
.002
A1
Standoff
§
0.95
0.90
0.85
.037
.035
.033
A2
Molded Package Thickness
1.10
.043
A
Overall Height
0.65
.026
p
Pitch
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
Foot Angle
φ
04
80
48
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
§ Significant Characteristic
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| 93C46CX-I/PG | 64 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 93C46BX-I/MC | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K Microwire Compatible Serial EEPROM |
| 93C46BX-I/MCG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K Microwire Compatible Serial EEPROM |
| 93C46BX-I/MS | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K Microwire Compatible Serial EEPROM |
| 93C46BX-I/MSG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K Microwire Compatible Serial EEPROM |
| 93C46BX-I/OT | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K Microwire Compatible Serial EEPROM |
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