- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄24828 > 935272013125 (NXP SEMICONDUCTORS) LVC/LCX/Z SERIES, 2-INPUT OR GATE, PDSO5 PDF資料下載
參數(shù)資料
| 型號： | 935272013125 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 門電路 |
| 英文描述： | LVC/LCX/Z SERIES, 2-INPUT OR GATE, PDSO5 |
| 封裝： | PLASTIC, SOT-753, SC-74A, 5 PIN |
| 文件頁數(shù)： | 5/19頁 |
| 文件大?。?/td> | 137K |
| 代理商： | 935272013125 |
2002 Nov 15
13
Philips Semiconductors
Product specication
Single 2-input OR gate
74LVC1G32
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 935268381118 | LVC/LCX/Z SERIES, 2-INPUT OR GATE, PDSO5 |
| 935268381115 | LVC/LCX/Z SERIES, 2-INPUT OR GATE, PDSO5 |
| 935268456118 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935268456125 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935268456165 | LVC/LCX/Z SERIES, 1-INPUT INVERT GATE, PDSO5 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 935272043518 | 制造商:NXP Semiconductors 功能描述:IC SM |
| 935272240128 | 制造商:NXP Semiconductors 功能描述:IC LED DRIVER BLINKER 16-HVQFN |
| 935275527134 | 制造商:NXP Semiconductors 功能描述:IC BUS SWITCH OCTAL QUAD 20TSSOP |
| 935277864112 | 制造商:NXP Semiconductors 功能描述:IC CPU |
| 935278818112 | 制造商:NXP Semiconductors 功能描述:LCD DRVR 20DIGIT 2.5V/3.3V/5V 56-Pin VSO Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。