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參數(shù)資料
| 型號： | 935265310118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 16 MHz, MICROCONTROLLER, PQCC44 |
| 封裝： | PLASTIC, LCC-44 |
| 文件頁數(shù)： | 69/80頁 |
| 文件大小： | 446K |
| 代理商： | 935265310118 |
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1997 Dec 15
71
Philips Semiconductors
Product specication
8-bit microcontrollers
P83C524; P80C528; P83C528
27 SOLDERING
27.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
27.2
DIP
27.2.1
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
27.2.2
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°C, contact may be up to 5 seconds.
27.3
PLCC and QFP
27.3.1
REFLOW SOLDERING
Reflow soldering techniques are suitable for all PLCC and
QFP packages.
The choice of heating method may be influenced by larger
PLCC or QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
“Quality
Reference Handbook” (order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
°C.
27.3.2
WAVE SOLDERING
27.3.2.1
PLCC
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream corners.
27.3.2.2
QFP
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
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