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參數(shù)資料
| 型號(hào)： | 935264467005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 8/24頁 |
| 文件大小： | 341K |
| 代理商： | 935264467005 |
1 Chip Specification
Rev. 2.2
January 2005
SL044022.doc/B
Public
Page 16 of 24
12 Handling Recommendations
12.1 Assembly
The bumped ICODE1 IC enables flip chip assembly using ACF (anisotropic conductive film),
ACP (anisotropic conductive pastes) and conductive glues.
13 Coil Specification
The ICODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical
parameters according to Philips application note ‘SL1 ICS30 01 ICODE1 Label IC, Coil Design
Guide’.
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