參數(shù)資料
型號: 935264043025
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: SPECIALTY TELECOM CIRCUIT, UUC13
封裝: DIE-13
文件頁數(shù): 13/29頁
文件大?。?/td> 236K
代理商: 935264043025
2000 Mar 28
20
Philips Semiconductors
Product specication
Gigabit Ethernet/Fibre Channel
transimpedance amplier
TZA3043; TZA3043B
Physical characteristics of the bare die
PARAMETER
VALUE
Glass passivation
2.1
m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride
Bonding pad dimension
minimum dimension of exposed metallization is 90
× 90 m (pad size = 100 × 100 m)
Metallization
1.22
m W/AlCu/TiW
Thickness
380
m nominal
Size
1.03
× 1.30 mm (1.34 mm2)
Backing
silicon; electrically connected to GND potential through substrate contacts
Attach temperature
<440
°C; recommended die attach is glue
Attach time
<15 s
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