參數(shù)資料
型號(hào): 935263511026
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: SPECIALTY TELECOM CIRCUIT, UUC13
封裝: DIE-13
文件頁(yè)數(shù): 11/29頁(yè)
文件大小: 236K
代理商: 935263511026
2000 Mar 28
19
Philips Semiconductors
Product specication
Gigabit Ethernet/Fibre Channel
transimpedance amplier
TZA3043; TZA3043B
BONDING PAD LOCATIONS
Note
1. All coordinates are referenced, in
m, to the bottom left-hand corner of the die.
SYMBOL
PAD TZA3043U
PAD TZA3043BU
COORDINATES(1)
xy
DREF
1
95
881
GND
2
95
618
GND
3
95
473
IPhoto
4
95
285
GND
5
215
95
GND
6
360
95
GND
7
549
95
GND
8
691
95
OUT
9
10
785
501
OUTQ
10
9
785
641
VCC
11
567
1055
VCC
12
424
1055
AGC
13
259
1055
TZA3043U
1
10
9
2
3
4
5
0
x
y
0
13
12
11
67
8
1300
m
1030
m
DREF
IPhoto
GND
OUTQ
OUT
MGU099
GND
AGC
V
CC
V
CC
GND
Fig.24 Bonding pad locations of the TZA3043U.
TZA3043BU
1
10
9
2
3
4
5
0
x
y
0
13
12
11
67
8
1300
m
1030
m
DREF
IPhoto
GND
OUT
OUTQ
MGU100
GND
AGC
V
CC
V
CC
GND
Fig.25 Bonding pad locations of the TZA3043BU.
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