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參數(shù)資料
| 型號： | 935263379112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | TELEPHONE SPEECH CKT, PDIP16 |
| 封裝： | 0.300 INCH, PLASTIC, SOT-38-4, DIP-16 |
| 文件頁數(shù)： | 4/30頁 |
| 文件大?。?/td> | 218K |
| 代理商： | 935263379112 |
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2000 Mar 21
12
Philips Semiconductors
Product specication
Low voltage telephone transmission circuit with
dialler interface and regulated strong supply
TEA1114A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Mostly dependent on the maximum required ambient temperature, on the voltage between LN and SLPE and on the
thermal resistance between die ambient temperature. This thermal resistance depends on the application board
layout and on the materials used. Figure 13 shows the safe operating area versus this thermal resistance for ambient
temperature Tamb =75 °C.
THERMAL CHARACTERISTICS
Note
1. Mounted on epoxy board 40.1
× 19.1 × 1.5 mm.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VLN
positive continuous line voltage
VEE 0.4
12
V
repetitive line voltage during switch-on or
line interruption
VEE 0.4
13.2
V
IDD
maximum input current at pin VDD
75
mA
Vn(max)
maximum voltage on all pins except pin VDD
VEE 0.4
VCC + 0.4
V
Iline
line current
RSLPE =20 ;
see Figs 11 and 12
140
mA
Ptot
total power dissipation
Tamb =75 °C;
see Figs 11 and 12
TEA1114A
625
mW
TEA1114AT
416
mW
TEA1114AUH; note 1
Tstg
storage temperature
40
+125
°C
Tamb
ambient temperature
25
+75
°C
Tj
junction temperature
125
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air; note 1
TEA1114A
70
K/W
TEA1114AT
115
K/W
TEA1114AUH
tbf by customer
application
K/W
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