參數(shù)資料
型號: 935260966005
廠商: NXP SEMICONDUCTORS
元件分類: 尋呼電路
英文描述: TELECOM, PAGING RECEIVER, UUC28
封裝: DIE-28
文件頁數(shù): 6/43頁
文件大?。?/td> 525K
代理商: 935260966005
1996 Jan 15
14
Philips Semiconductors
Product specication
Advanced pager receiver
UAA2082
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 4 for bonding pad description and locations for x/y co-ordinates.
Fig.8 Bonding pad locations.
Chip area: 18.15 mm2
Chip thickness: 380
±20 m.
Drawing not to scale.
handbook, full pagewidth
MLC229
28
1
2
3
4
5
6
7
8
9
10
11
UAA2082U
3.83
mm
4.74 mm
0
y
x
24
23
22
21
20
19
18
17
16
15
14
13
12
27
26
25
Where:
Pad number 1 (diameter 124 m)
Pad not used
Pad 124 m x 124 m
Pad 100 m x 100 m
Pad 100 m x 100 m with reference point
相關(guān)PDF資料
PDF描述
0672-0-15-80-30-84-10-0 BERYLLIUM COPPER ALLOY, TIN (100) OVER NICKEL FINISH, PCB TERMINAL
0672-0-15-15-30-27-10-0 BERYLLIUM COPPER ALLOY, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
0672-0-15-80-30-27-10-0 BERYLLIUM COPPER ALLOY, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
0672-0-15-15-30-02-10-0 BERYLLIUM COPPER ALLOY, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL
0672-0-15-80-30-02-10-0 BERYLLIUM COPPER ALLOY, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL
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