參數(shù)資料
型號: 934056265118
廠商: NXP SEMICONDUCTORS
元件分類: JFETs
英文描述: 54 A, 55 V, 0.021 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: PLASTIC, SMD, D2PAK-3
文件頁數(shù): 11/15頁
文件大小: 311K
代理商: 934056265118
Philips Semiconductors
BUK9520-55A; BUK9620-55A
TrenchMOS logic level FET
Product specication
Rev. 01 — 29 January 2001
5 of 15
9397 750 07794
Philips Electronics N.V. 2001. All rights reserved.
8.
Characteristics
Table 5:
Characteristics
Tj =25 °C unless otherwise specied
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source breakdown
voltage
ID = 0.25 mA; VGS =0V
Tj =25 °C55
V
Tj = 55 °C50
V
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS =VGS;
Tj =25 °C
1
1.5
2
V
Tj = 175 °C
0.5
V
Tj = 55 °C
2.3
V
IDSS
drain-source leakage current
VDS = 55 V; VGS =0V
Tj =25 °C
0.05
10
A
Tj = 175 °C
500
A
IGSS
gate-source leakage current
VGS = ±10 V; VDS =0V
2
100
nA
RDSon
drain-source on-state
resistance
VGS =5V; ID =25A;
Tj =25 °C
17
20
m
Tj = 175 °C
40
m
VGS = 4.5 V; ID =25A
21
m
VGS =10V; ID =25A
15
18
m
Dynamic characteristics
Ciss
input capacitance
VGS =0V; VDS =25V;
f = 1 MHz; Figure 12
1660
2210
pF
Coss
output capacitance
290
346
pF
Crss
reverse transfer capacitance
194
266
pF
td(on)
turn-on delay time
VDD = 30 V; RL = 1.2 ;
VGS =5V; RG =10
19
ns
tr
rise time
124
ns
td(off)
turn-off delay time
92
ns
tf
fall time
93
ns
Ld
internal drain inductance
from drain lead 6 mm from
package to centre of die
4.5
nH
from contact screw on
mounting base to centre of
die SOT78
3.5
nH
from upper edge of drain
mounting base to centre of
die SOT404
2.5
nH
Ls
internal source inductance
from source lead to source
bond pad
7.5
nH
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