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參數(shù)資料
| 型號： | 934055344112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 整流器 |
| 英文描述： | 2.08 A, 600 V, SILICON, RECTIFIER DIODE |
| 封裝： | HERMETIC SEALED, GLASS PACKAGE-2 |
| 文件頁數(shù)： | 5/12頁 |
| 文件大小： | 70K |
| 代理商： | 934055344112 |
1996 May 24
2
Philips Semiconductors
Product specication
Fast soft-recovery
controlled avalanche rectiers
BYM26 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Available in ammo-pack
Also available with preformed leads
for easy insertion.
DESCRIPTION
Rugged glass SOD64 package,
using a high temperature alloyed
construction. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
Fig.1 Simplified outline (SOD64) and symbol.
2/3 page (Datasheet)
MAM104
ka
,
,
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYM26A
200
V
BYM26B
400
V
BYM26C
600
V
BYM26D
800
V
BYM26E
1000
V
BYM26F
1200
V
BYM26G
1400
V
VR
continuous reverse voltage
BYM26A
200
V
BYM26B
400
V
BYM26C
600
V
BYM26D
800
V
BYM26E
1000
V
BYM26F
1200
V
BYM26G
1400
V
IF(AV)
average forward current
Ttp =55 °C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYM26A to E
2.30
A
BYM26F and G
2.40
A
IF(AV)
average forward current
Tamb =65 °C; PCB mounting (see
Fig.19); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYM26A to E
1.05
A
BYM26F and G
1.00
A
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