- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄24773 > 933851660112 (NXP SEMICONDUCTORS) 8 I/O, PIA-GENERAL PURPOSE, PDSO16 PDF資料下載
參數(shù)資料
| 型號： | 933851660112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| 封裝： | 7.50 MM, LEAD FREE, PLASTIC, MS-013, SOT-162-1, SO-16 |
| 文件頁數(shù)： | 13/33頁 |
| 文件大?。?/td> | 316K |
| 代理商： | 933851660112 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁當前第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁
2002 Nov 22
20
Philips Semiconductors
Product specication
Remote 8-bit I/O expander for I2C-bus
PCF8574
13 SOLDERING
13.1
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
13.2
Through-hole mount packages
13.2.1
SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
13.2.2
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
13.3
Surface mount packages
13.3.1
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°C. The top-surface temperature of the
packages should preferable be kept below 220
°C for
thick/large packages, and below 235
°C for small/thin
packages.
13.3.2
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
13.3.3
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320
°C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 935275581518 | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| 935271753118 | 8 I/O, PIA-GENERAL PURPOSE, PDSO20 |
| 935275581112 | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| 0672.300 | Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:55; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:22-55 |
| 935084920112 | TELEPHONE SPEECH CKT, PDSO20 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 9338-5M | 制造商:PRO ELEC 功能描述:EXTENSION LEAD 3WAY 5M 制造商:PRO ELEC 功能描述:EXTENSION LEAD, 3WAY, 5M |
| 933861-000 | 功能描述:焊料和屏蔽管 SO63-3-9030 RoHS:否 制造商:TE Connectivity / Raychem 類型:Shield Terminators 材料:Polyvinylidene Fluoride 內(nèi)徑:5.08 mm 長度:16.5 mm 最低收縮溫度: 系列:S03 |
| 933871-1 | 制造商:TE Connectivity 功能描述:GUIDE, MODIFIED - Bulk |
| 9-338728-0 | 功能描述:集管和線殼 MICROM. MOB SMD CON RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector |
| 933873-1 | 制造商:TE Connectivity 功能描述:PLATE, CYL MTG. - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復。