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參數(shù)資料
| 型號： | 933835630005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | FIFO |
| 英文描述： | 64 X 9 OTHER FIFO, 520 ns, UUC |
| 封裝： | DIE |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 166K |
| 代理商： | 933835630005 |
Philips Semiconductors
Product specification
TOPFET high side switch
PIP3203-A
MECHANICAL DATA
Fig.4. SOT263B package
1 leadform 263B-01, pin 3 connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT263B-01
5-lead (option)
TO-220
D
D1
q
L
15
L3
mounting
base
L4
m
e
Q
b
0
5
10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole;
5-lead TO-220 lead form option
SOT263B-01
UNIT
A1
D1
eL
p
mm
1.7
L1
L2
q
3.0
2.7
4.5
4.1
1.39
1.27
0.85
0.70
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
9.8
9.7
5.9
5.3
5.2
5.0
2.4
1.6
0.8
0.6
3.8
3.6
p1
4.3
4.1
Q1
Q
2.0
4.5
Q2
8.2
R
0.5
w
0.4
DIMENSIONS (mm are the original dimensions)
A
b
D
c
0.5
L3
(1)
L4
(2)
max.
E
m
A
A1
c
Q1
Q2
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
L1
L2
R
w M
01-01-11
p
p1
E
1 Refer to mounting instructions for TO220 envelopes. Epoxy meets UL94 VO at 1/8". Net mass: 2 g
October 2001
7
Rev 1.000
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