參數(shù)資料
型號： 9-1437535-8
元件分類： 插座
英文描述： DIP14, IC SOCKET
文件頁數(shù)： 1/3頁
文件大?。?/td> 207K
代理商： 9-1437535-8
Sockets
DIP Sockets
514-AG12D-ES
(Tyco Electronics P/N: 9-1437535-8)
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Related Part Information
General Information
eCommerce
Related Part Information
Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
Non-compliant
Lead Free Solder
Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
14
Row-to-Row Spacing
(mm [in]):
7.62 [0.300]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Profile:
Standard
Frame Style:
Closed
Leg Style:
Straight
Contact Material:
Beryllium Copper
Contact Mating Area
Plating:
Tin-Lead
Contact Style:
Stamped + Formed
Other Properties:
Insulation Resistance
(MΩ):
5,000
Contact Resistance
(mO):
10
Sleeve Material:
Brass/Copper
Contact Termination
Area Plating:
Tin-Lead
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
9-1437537-0 功能描述:IC 與器件插座 824-AG31F SOCKET ASSY RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
9-1437537-2 功能描述:IC 與器件插座 24 POS THRU HOLE RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
9-1437537-3 功能描述:IC 與器件插座 824-AG334D SOCKET ASSY RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
9-1437537-4 功能描述:IC 與器件插座 824-AG338D SOCKET ASSY RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
9-1437537-8 制造商:TE Connectivity 功能描述:CONN DIP SCKT SKT 24 POS 2.54MM SLDR ST TH - Bulk 制造商:TE Connectivity 功能描述:824-AG66D=SOCKET ASSY
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