參數(shù)資料
型號(hào): 8600V
廠商: Lattice Semiconductor Corporation
英文描述: 3.3V In-System Programmable SuperBIG⑩ High Density PLD
中文描述: 3.3在系統(tǒng)可編程SuperBIG⑩高密度可編程邏輯器件
文件頁數(shù): 1/26頁
文件大?。?/td> 333K
代理商: 8600V
ispLSI
3.3V In-System Programmable
SuperBIG High Density PLD
8600V
8600v_03
1
Copyright 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
Features
SuperBIG HIGH DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
— 3.3V Power Supply
— 32,000 PLD Gates/600 Macrocells
— 192-264 I/O Pins Supporting 3.3V/2.5V I/O
— 864 Registers
— High-Speed Global and Big Fast Megablock (BFM)
Interconnect
— Wide 20-Macrocell Generic Logic Block (GLB) for
High Performance
— Wide Input Gating (44 Inputs per GLB) for Fast
Counters, State Machines, Address Decoders, Etc.
— PCB-Efficient Ball Grid Array (BGA) Package
Options
HIGH-PERFORMANCE E
2
CMOS
TECHNOLOGY
f
max
= 125 MHz Maximum Operating Frequency
t
pd
= 8.5 ns Propagation Delay
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Programmable Speed/Power Logic Path
Optimization
IN-SYSTEM PROGRAMMABLE
— Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Debugging
100% IEEE 1149.1 BOUNDARY SCAN TESTABLE AND
3.3V IN-SYSTEM PROGRAMMABLE
ARCHITECTURE FEATURES
— Enhanced Pin-Locking Architecture, Symmetrical
Generic Logic Blocks Connected by Hierarchical
Big Fast Megablock and Global Routing Planes
— Product Term Sharing Array Supports up to 28
Product Terms per Macrocell Output
— Macrocells Support Concurrent Combinatorial and
Registered Functions
— Embedded Tristate Bus Can Be Used as an Internal
Tristate Bus or as an Extension of an External
Tristate Bus
— Macrocell and I/O Registers Feature Multiple Control
Options, Including Set, Reset and Clock Enable
— I/O Pins Support Programmable Bus Hold, Pull-Up,
Open-Drain and Slew Rate Options
— Separate VCCIO Power Supply to Support 3.3V or
2.5V Input/Output Logic Levels
— I/O Cell Register Programmable as Input Register for
Fast Setup Time or Output Register for Fast Clock to
Output Time
ispDesignEXPERT – LOGIC COMPILER AND COM-
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER
— PC and UNIX Platforms
Functional Block Diagram
ispLSI 8000V Family Description
The ispLSI 8000V Family of Register-Intensive, 3.3V
SuperBIG In-System Programmable Logic Devices is
based on Big Fast Megablocks of 120 registered macro-
cells and a Global Routing Plane (GRP) structure
interconnecting the Big Fast Megablocks. Each Big Fast
Megablock contains 120 registered macrocells arranged
in six groups of 20, a group of 20 being referred to as a
Generic Logic Block, or GLB. Within the Big Fast
Megablock, a Big Fast Megablock Routing Pool (BRP)
interconnects the six GLBs to each other and to 24 Big
Fast Megablock I/O cells with optional I/O registers. The
Global Routing Plane which interconnects the Big Fast
Megablocks has additional global I/Os with optional I/O
registers. The 192-I/O version contains 72 Big Fast
Megablock I/O and 120 global I/O, while the 264-I/O
Global Routing Plane
12
I/O
12
I/O
Big Fast Megablock 0
12
I/O
12
I/O
Big Fast Megablock 1
12
I/O
12
I/O
Big Fast Megablock 3
12
I/O
12
I/O
Big Fast Megablock 4
12
I/O
12
I/O
Big Fast Megablock 2
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
12
I/O
Boundary
Scan
8600v block
July 2000
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