- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄364521 > 85222A02 1-TO-2 LVCMOS / LVTTL-TO DIFFERENTIAL HSTL TRANSLATOR PDF資料下載
參數(shù)資料
| 型號： | 85222A02 |
| 英文描述： | 1-TO-2 LVCMOS / LVTTL-TO DIFFERENTIAL HSTL TRANSLATOR |
| 中文描述： | 1到2的LVCMOS / LVTTL至差分HSTL譯者 |
| 文件頁數(shù)： | 6/10頁 |
| 文件大小： | 131K |
| 代理商： | 85222A02 |
85222AM-02
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
6
Integrated
Circuit
Systems, Inc.
ICS85222-02
1-
TO
-2 LVCMOS / LVTTL-
TO
-
D
IFFERENTIAL
HSTL T
RANSLATOR
PRELIMINARY
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85222-02.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85222-02 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.465V * 90mA =
311.85mW
Power (outputs)
MAX
=
73.8mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 73.8mW =
147.6mW
Total Power
_MAX
(3.465V, with all outputs switching) =
121.3mW + 147.6mW =
459.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total device power dissipation (example calculation is in Section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 5 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.460W * 103.3°C/W = 117.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
T
ABLE
5. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8-P
IN
SOIC, F
ORCED
C
ONVECTION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 8526-6002-13 | Directional Couplers Ultra-Broadband |
| 2026-6001-10 | Directional Couplers Ultra-Broadband |
| 2026-6002-16 | Directional Couplers Ultra-Broadband |
| 2026-6003-20 | Directional Couplers Ultra-Broadband |
| 2026-6004-10 | Directional Couplers Ultra-Broadband |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 85222AM | 制造商:Integrated Device Technology Inc 功能描述:CLOCK BFFR 4-OUT 8SOIC - Rail/Tube |
| 85222AM-01 | 制造商:Integrated Device Technology Inc 功能描述:CLOCK BFFR 4-OUT 8SOIC - Rail/Tube |
| 85222AM-01LF | 功能描述:轉(zhuǎn)換 - 電壓電平 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| 85222AM-01LFT | 功能描述:轉(zhuǎn)換 - 電壓電平 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| 85222AM-01T | 制造商:Integrated Device Technology Inc 功能描述:CLOCK BFFR 4-OUT 8SOIC - Tape and Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。