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參數(shù)資料
| 型號： | 85211AMI |
| 英文描述： | LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER |
| 中文描述： | 低偏移，1至2差分至LVHSTL扇出緩沖器 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 103K |
| 代理商： | 85211AMI |
85211AMI
www.icst.com/products/hiperclocks.html
REV. B ARPIL 8, 2003
7
ICS85211I
L
OW
S
KEW
, 1-
TO
-2
D
IFFERENTIAL
-
TO
-LVHSTL F
ANOUT
B
UFFER
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS85211I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85211I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.465V * 50mA =
173.3mW
Power (outputs)
MAX
=
78.88mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 78.88mW =
157.8mW
Total Power
_MAX
(3.465V, with all outputs switching) =
173.3mW + 157.8mW =
311.1mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125
°
C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA
must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3
°
C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85
°
C with all outputs switching is:
85
°
C + 0.311W * 103.3
°
C/W = 117.1
°
C. This is well below the limit of 125
°
C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
153.3
°
C/W
112.7
°
C/W
128.5
°
C/W
103.3
°
C/W
115.5
°
C/W
97.1
°
C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
T
ABLE
6. T
HERMAL
R
ESISTANCE
JA
FOR
8-
PIN
SOIC, F
ORCED
C
ONVECTION
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 85211AMI-01 | 制造商:Integrated Device Technology Inc 功能描述:CLOCK DRVR 4-OUT 8SOIC - Rail/Tube |
| 85211AMI-01LF | 功能描述:時鐘緩沖器 Low Skew 1-to-2 Diff .-to-LVHSTL Fanout B RoHS:否 制造商:Texas Instruments 輸出端數(shù)量:5 最大輸入頻率:40 MHz 傳播延遲（最大值）: 電源電壓-最大:3.45 V 電源電壓-最小:2.375 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LLP-24 封裝:Reel |
| 85211AMI-01LFT | 功能描述:時鐘驅(qū)動器及分配 Low Skew 1-to-2 Diff .-to-LVHSTL Fanout B RoHS:否 制造商:Micrel 乘法/除法因子:1:4 輸出類型:Differential 最大輸出頻率:4.2 GHz 電源電壓-最大: 電源電壓-最小:5 V 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-8 封裝:Reel |
| 85211AMI-01T | 制造商:Integrated Device Technology Inc 功能描述:CLOCK DRVR 4-OUT 8SOIC - Tape and Reel |
| 85211AMI-03 | 制造商:Integrated Device Technology Inc 功能描述:CLOCK DRVR 2-OUT 8SOIC - Rail/Tube |
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