參數(shù)資料
型號(hào): 834-93-011-10-001000
廠商: MILL-MAX MFG CORP
元件分類: 電路板相疊連接器
英文描述: 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
文件頁(yè)數(shù): 1/1頁(yè)
文件大?。?/td> 193K
代理商: 834-93-011-10-001000
INTERCONNECTS
2,54 Grid OFP Pass Through Sockets for 0,76 &
0,64 pins
Single and Double Row
www.mill-max.com
516-922-6000
87
Series 834, 835
2,54
X 2,54 / 2
Number of Pins
0,64-0,91
0,64
0,64 0,64
0,64
5,08
2,24
2,79
3,3
2,03
2,54
1,09 DIA.
1,55 DIA.
0,91 DIA.
1,09 DIA.
1,55 DIA.
2,79
2,54
3,3
2,03
2,54
2,24
0,91 DIA.
X 2,54
Number of Pins
0,64-0,91
0,64
0,64 0,64
0,64
UPPER
CIRCUIT
BOARD
MIDDLE
CIRCUIT
BOARD
LOWER
CIRCUIT
BOARD
INTER-CONNECTION
PIN
PASS THRU
SOCKETS
#47 SPRING
CONTACT
SOCKET
INSULATOR
SOCKET
SLEEVE
CIRCUIT
BOARD
SOLDER
JOINT
ORGANIC FIBER PLUG
PUSHED OUT BY INTER-CONNECT
PIN AFTER SOLDERING
0,76 or
0,64 PINS
Ordering Information
Single Row OFP Pass Through Socket
834-XX-0 _ _-10-001000
Fig. 1
Specify # of pins
01-64
Double Row OFP Pass Through Socket
835-XX-0 _ _-10-001000
Fig. 2
Specify # of pins
02-72
834/835 Series Pass Through Sockets have a
low 3,30 profile and will accept 0,76 round
pin, as well as industry standard 0,64 square
pin headers.
They are typically used to interconnect two or
more parallel circuit boards.
Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
Unique ORGANIC FIBRE PLUG barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
OFP barriers are pushed out of the socket
when the mating header is inserted.
Mill-Max sockets use a precision-machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
Recommended mounting holes are 1,17
±0,08 PTH (1,2 mm drilled prior to plating).
*Intrusive reflow (also called "pin-in-paste") is a
technique of using conventional through-hole
components in a reflow soldering process. The pass
through socket is placed into plated through-holes in
the circuit board (solder paste has previously been
screen printed on pads adjacent to the holes) and
the board is reflowed in the same pass as other SMT
components. Solder will fill the plated through-holes
and achieve solder joints as reliable as wave solder-
ing. The OFP barrier prevents solder paste from
being picked-up inside the contact during assembly.
Fig. 1
Fig. 2
Typical Application
US Patent #7,086,870
SPECIFY PLATING CODE XX=
13
93
99
43
44
Sleeve (Pin)
Contact (Clip)
RoHS
2002/95/EC
XX=Plating Code
See Below
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
For RoHS compliance
select plating code.
5,08m Sn/Pb
5,08m Sn
0,76m Au
相關(guān)PDF資料
PDF描述
834-93-012-10-001000 12 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
834-93-013-10-001000 13 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
834-93-014-10-001000 14 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
834-93-015-10-001000 15 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
834-93-016-10-001000 16 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
834-93-012-10-001000 功能描述:SKT SNG PASS THRU 制造商:mill-max manufacturing corp. 系列:834 包裝:散裝 零件狀態(tài):在售 連接器類型:插座,通透式 觸頭類型:母形插口 樣式:板至板 針腳數(shù):12 加載的針腳數(shù):全部 間距 - 配接:0.100"(2.54mm) 排數(shù):1 行間距 - 配接:- 安裝類型:通孔 端接:焊接 緊固類型:推挽式 觸頭表面處理 - 配接:金 觸頭表面處理厚度 - 配接:30μin(0.76μm) 絕緣顏色:黑色 絕緣高度:0.130"(3.30mm) 接觸長(zhǎng)度 - 接線柱:0.080"(2.03mm) 工作溫度:-55°C ~ 125°C 材料可燃性等級(jí):UL94 V-0 觸頭表面處理 - 柱:錫 - 鉛 接合堆疊高度:- 侵入防護(hù):- 特性:- 額定電流:- 額定電壓:- 應(yīng)用:- 絕緣材料:聚對(duì)苯二甲酸二甲基環(huán)己酯(PCT),聚酯 觸頭形狀:圓形 觸頭材料:銅鈹 觸頭表面處理厚度 - 柱:200μin(5.08μm) 標(biāo)準(zhǔn)包裝:50
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