參數(shù)資料
型號(hào): 82371AB
廠商: INTEL CORP
元件分類: 總線控制器
英文描述: Multi-Function PCI Device(多功能PCI設(shè)備)
中文描述: ISA BUS CONTROLLER, PBGA324
封裝: BGA-324
文件頁(yè)數(shù): 7/56頁(yè)
文件大?。?/td> 487K
代理商: 82371AB
82371AB (PIIX4) Timing Specification
PRELIMINARY
1
1.0
Introduction
This document contains the electrical and the thermal specifications for the 82371AB (PIIX4). PIIX4 is a multi-
function PCI device implementing a PCI-to-ISA bridge function, a PCI IDE function, a Universal Serial Bus
Host/Hub function, and a Power Management function.
The contents of this document are based on simulation and parametric data. This information may be modified
as more data is available.
1.1
References
The reader should be familiar with the following documents:
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4)
datasheet
Universal Serial Bus Specification
Universal Host Controller Interface (UHCI) Design Guide
System Management Bus Specification
Serialized IRQ Support for PCI Systems Specification
Distributed DMA Support for PCI Systems Specification
2.0
Electrical Characteristics
2.1
Absolute Maximum Ratings
Case temperature under bias.........................................................................................................0° C to +85° C
Storage temperature................................................................................................................. -55° C to +150° C
Voltage on any pin with respect to ground .............................................................................. -0.3 to V
+0.3 V
3.3 V supply voltage with respect to V
SS
.........................................................................................-0.3 to +4.6 V
5.0 V supply voltage with respect to V
(VREF)............................................................................-0.3 to +5.5 V
Maximum Power Dissipation ....................................................................................................................... 1.0 W
WARNING
: Stressing the device beyond the “Absolute MaximumRatings” may cause permanent damage. These are stress ratings
only. Operation beyond the “Operating Conditions” is not recommended and extended exposure beyond the “Operating Conditions”
may affect device reliability.
The 82371AB PIIX4 (BGA) is designed for operation at case temperatures between 0°C and 85°C. The thermal
resistances of the package are given in Table 1.
Table 1. Package Thermal Resistance
Parameter
Air Flow
Meters/Second (Linear Feet per Minute)
0 (0)
1.0 (196.9)
θ
ja (°C/Watt)
θ
jc (°C/Watt)
29
24.5
9.0
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