2
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
Through Hole Through Hole Through Hole Through Hole
2
1
V
CC
, GND
None
8 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack 20 Pad LCCC
Unformed Leads
4
V
CC
, GND
Lead Style
Channels
Common Channel
Wiring
Withstand Test Voltage
Agilent Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Surface Mount
2
None
2
2
V
CC
, GND
V
CC
, GND
1500 Vdc
1500 Vdc
1500 Vdc
2500 Vdc
1500 Vdc
1500 Vdc
6N134*
6N134/883B
HCPL-268K
Gold Plate
Option #200
Option #100
Option #300
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
Option #200
Option #100
Option #300
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
Option #200
Option #100
Option #300
HCPL-5650
HCPL-5651
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads
Gold Plate
Option #200
None
5962-
None
None
None
None
8102801EX
8102801EC
8102801EA
8102801UC
8102801UA
8102801TA
9085501HPX
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
8102802PX
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
8102805PX
8102805PC
8102805PA
8102804FX
8102804FC
81028032X
81028032A
5962-
5962-
5962-
5962-
5962-
9800101KEX 9085501KPX
9800101KEC 9085501KPC 9800102KPC
9800101KEA 9085501KPA
9800101KUC 9085501KYC
9800101KUA 9085501KYA
9800101KTA
9085501KXA
9800102KPX
9800104KFX
9800104KFC
9800103K2X
9800102KPA
9800102KYC
9800102KYA
9800102KZA
9800103K2A
*JEDEC registered part.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high speed photon detector. The
output of the detector is an open
collector Schottky clamped
transistor. Internal shields
provide a guaranteed common
mode transient immunity
specification of 1000 V/
μ
s. For
Isolation Voltage applications
requiring up to 2500 Vdc, the
HCPL-5650 family is also
available. Package styles for
these parts are 8 and 16 pin DIP
through hole (case outlines P and
E respectively), and 16 pin
surface mount DIP flat pack
(case outline F), leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the figures
are identical for all parts.
Occasional exceptions exist due to
package variations and limitations,
and are as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other parts’ performance
for reliability and certain limited
radiation test results.