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參數(shù)資料
| 型號(hào)： | 7HCPL-5230-200 |
| 英文描述： | Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers |
| 中文描述： | 密封，中頻，寬虛擬通道連接，低邏輯門光電耦合器 |
| 文件頁數(shù)： | 2/12頁 |
| 文件大小： | 294K |
| 代理商： | 7HCPL-5230-200 |
2
Selection Guide–Package Styles and Lead Configuration Options
Package
8 Pin DIP
Lead Style
Through Hole
Channels
1
Common Channel
None
Wiring
Agilent Part # & Options
Commercial
HCPL-5200
MIL-PRF-38534, Class H
HCPL-5201
MIL-PRF-38534, Class K
HCPL-520K
Standard Lead Finish
Gold Plate
Solder Dipped
Option #200
Butt Cut/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
Class H SMD Part #
Prescript for all below
5962-
Either Gold or Solder
8876801PX
Gold Plate
8876801PC
Solder Dipped
8876801PA
Butt Cut/Gold Plate
8876801YC
Butt Cut/Soldered
8876801YA
Gull Wing/Soldered
8876801XA
Class K SMD Part #
Prescript for all below
5962-
Either Gold or Solder
8876802KPX
Gold Plate
8876802KPC
Solder Dipped
8876802KPA
Butt Cut/Gold Plate
8876802KYC
Butt Cut/Soldered
8876802KYA
Gull Wing/Soldered
8876802KXA
8 Pin DIP
Through Hole
2
V
CC
, GND
16 Pin Flat Pack
Unformed Leads
4
V
CC
, GND
20 Pad LCCC
Surface Mount
2
None
HCPL-5230
HCPL-5231
HCPL-523K
Gold Plate
Option #200
Option #100
Option #300
HCPL-6250
HCPL-6251
HCPL-625K
Gold Plate
HCPL-6230
HCPL-6231
HCPL-623K
Soldered Pads
5962-
5962-
5962-
8876901PX
8876901PC
8876901PA
8876901YC
8876901YA
8876901XA
8876903FX
8876903FC
88769022X
88769022A
5962-
5962-
5962-
8876904KPX
8876904KPC
8876904KPA
8876904KYC
8876904KYA
8876904KXA
8876906KFX
8876906KFC
8876905K2X
8876905K2A
which allows for direct connection
to data buses. The output is non-
inverting. The detector IC has an
internal shield that provides a
guaranteed common mode
transient immunity of up to
10,000 V/
μ
s. Improved power
supply rejection eliminates the
need for special power supply
bypass precautions.
Package styles for these parts are
8 pin DIP through hole (case
outline P), 16 pin DIP flat pack
(case outline F), and leadless
ceramic chip carrier (case outline
2). Devices may be purchased
with a variety of lead bend and
plating options, see Selection
Guide Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and limita-
tions and are as noted. Addition-
ally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s per-
formance for die related
reliability and certain limited
radiation test results.
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