Data Sheet U14121EJ2V0DS00
90
μ
PD784214A, 784215A, 784216A, 784217A, 784218A, 784214AY, 784215AY, 784216AY, 784217AY, 784218AY
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784218A should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD784214AGC-
μ
PD784215AGC-
×××
μ
PD784216AGC-
μ
PD784217AGC-
μ
PD784218AGC-
×××
μ
PD784214AYGC-
μ
PD784215AYGC-
×××
μ
PD784216AYGC-
μ
PD784217AYGC-
μ
PD784218AYGC-
×××
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU:100-pin plastic LQFP(fine pitch) (14
×
14 mm)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
for 10 hours)
Note
(after that, prebake at 125
°
C
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
for 10 hours)
Note
(after that, prebake at 125
°
C
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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