參數(shù)資料
型號(hào): 74LVT373WM
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 8/10頁(yè)
文件大小: 0K
描述: IC LATCH TRANSP OCT 3ST 20SOIC
標(biāo)準(zhǔn)包裝: 36
系列: 74LVT
邏輯類型: D 型透明鎖存器
電路: 8:8
輸出類型: 三態(tài)
電源電壓: 2.7 V ~ 3.6 V
獨(dú)立電路: 1
延遲時(shí)間 - 傳輸: 1.5ns
輸出電流高,低: 32mA,64mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC
包裝: 管件
1999 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LVT373, 74LVTH373 Rev. 1.5.0
7
74L
VT373,
74L
VTH373
Lo
w
V
olta
g
e
Octal
T
ransparent
Latc
h
with
3-ST
A
TE
Outputs
Physical Dimensions
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
0.10
C
A
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
PIN ONE
INDICATOR
0.25
1
10
B
C
A
M
20
11
B
X45
°
8
°
0
°
SEATING PLANE
GAGE PLANE
DETAIL A
SCALE: 2:1
SEATING PLANE
LAND PATTERN RECOMMENDATION
F) DRAWING FILENAME: MKT-M20BREV3
0.65
1.27
2.25
9.50
13.00
12.60
11.43
7.60
7.40
10.65
10.00
0.51
0.35
1.27
2.65 MAX
0.30
0.10
0.33
0.20
0.75
0.25
(R0.10)
1.27
0.40
(1.40)
0.25
D) CONFORMS TO ASME Y14.5M-1994
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74LVT374D 功能描述:觸發(fā)器 3.3V OCT D-TYPE 3-S RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel