參數(shù)資料
型號: 74LVC1G126GF,132
廠商: NXP Semiconductors
文件頁數(shù): 12/21頁
文件大小: 0K
描述: IC BUFFER/DVR 3ST N-INV 6XSON
產(chǎn)品培訓模塊: Logic Packages
特色產(chǎn)品: MicroPak?
標準包裝: 1
系列: 74LVC
邏輯類型: 緩沖器/線路驅(qū)動器,非反相
元件數(shù): 1
每個元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-XFDFN
供應商設備封裝: 6-XSON,SOT891(1x1)
包裝: 標準包裝
其它名稱: 568-9289-6
74LVC1G126
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 12 — 2 July 2012
2 of 21
NXP Semiconductors
74LVC1G126
Bus buffer/line driver; 3-state
3.
Ordering information
4.
Marking
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5.
Functional diagram
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G126GW
40 Cto+125 C
TSSOP5
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
74LVC1G126GV
40 Cto+125 C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74LVC1G126GM
40 Cto+125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
1.45 0.5 mm
SOT886
74LVC1G126GF
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
1 0.5 mm
SOT891
74LVC1G126GN
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9
1.0 0.35 mm
SOT1115
74LVC1G126GS
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0
1.0 0.35 mm
SOT1202
74LVC1G126GX
40 C to +125 C
X2SON5
X2SON5: plastic thermal enhanced extremely
thin small outline package; no leads; 5
terminals; body 0.8
0.8 0.35 mm
SOT1226
Table 2.
Marking codes
Type number
Marking[1]
74LVC1G126GW
VN
74LVC1G126GV
V26
74LVC1G126GM
VN
74LVC1G126GF
VN
74LVC1G126GN
VN
74LVC1G126GS
VN
74LVC1G126GX
VN
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
mna125
A
OE
Y
2
1
4
mna126
1
4
OE
2
mna127
OE
A
Y
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