參數(shù)資料
型號(hào): 74LVC1G07GF,132
廠商: NXP Semiconductors
文件頁(yè)數(shù): 2/18頁(yè)
文件大?。?/td> 0K
描述: IC BUFFER OPEN DRAIN N-INV 6XSON
產(chǎn)品培訓(xùn)模塊: Logic Packages
特色產(chǎn)品: MicroPak?
標(biāo)準(zhǔn)包裝: 5,000
系列: 74LVC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相并帶開(kāi)漏極
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-XFDFN
供應(yīng)商設(shè)備封裝: 6-XSON,SOT891(1x1)
包裝: 帶卷 (TR)
其它名稱: 568-9282-2
74LVC1G07GF,132-ND
74LVC1G07GF-H
74LVC1G07GF-H-ND
935282406132
74LVC1G07
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 11 — 29 June 2012
10 of 18
NXP Semiconductors
74LVC1G07
Buffer with open-drain output
Fig 12. Package outline SOT886 (XSON6)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT886
MO-252
sot886_po
04-07-22
12-01-05
Unit
mm
max
nom
min
0.5
0.04
1.50
1.45
1.40
1.05
1.00
0.95
0.35
0.30
0.27
0.40
0.35
0.32
0.6
A(1)
Dimensions (mm are the original dimensions)
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
A1
b
0.25
0.20
0.17
DE
e
e1
0.5
LL1
terminal 1
index area
D
E
e1
e
A1
b
L
L1
e1
0
1
2 mm
scale
1
6
2
5
3
4
6x
(2)
4x
(2)
A
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