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參數(shù)資料
| 型號(hào)： | 74HCT245D-T |
| 英文描述： | Single 8-bit Bus Transceiver |
| 中文描述： | 單8位總線收發(fā)器 |
| 文件頁(yè)數(shù)： | 14/16頁(yè) |
| 文件大?。?/td> | 83K |
| 代理商： | 74HCT245D-T |
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2003 May 14
14
Philips Semiconductors
Product specification
Dual 2-input NOR gate
74HC2G02; 74HCT2G02
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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| 74HCT245DTR2G | 功能描述:總線收發(fā)器 OCTAL BUS TRANSCEIVER RoHS:否 制造商:Fairchild Semiconductor 邏輯類(lèi)型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類(lèi)型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74HCT245E | 制造商:Semiconductors 功能描述: |
| 74HCT245M | 制造商:HAR 功能描述:74HCT245 HARRIS S1I2B |
| 74HCT245N | 制造商:NXP Semiconductors 功能描述:HCT Bus Transceiver 制造商:NXP Semiconductors 功能描述:IC 74HCT CMOS 74HCT245 DIP20 5V 制造商:NXP Semiconductors 功能描述:IC, 74HCT CMOS, 74HCT245, DIP20, 5V 制造商:NXP Semiconductors 功能描述:IC, OCTAL BUS TRANSCEIVER, 3-STATE, 20-DIP; Logic Device Type:Transceiver, Non Inverting; Supply Voltage Min:4.5V; Supply Voltage Max:5.5V; Logic Case Style:DIP; No. of Pins:20; Operating Temperature Min:-40C; No. of Circuits:8 ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Bus XCVR Single 8-CH 3-ST 20-Pin PDIP Bulk |
| 74HCT245N,652 | 功能描述:總線收發(fā)器 OCTAL BUS TXRX 3ST RoHS:否 制造商:Fairchild Semiconductor 邏輯類(lèi)型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類(lèi)型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
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